“…Secondly, as a general feature of phase change materials, there is a severe volume shrinkage (6.5%–9.6%910) and corresponding increase in mass density upon crystallisation, which applies considerable mechanical stresses in the PCM cells11, and consequently, causes resistance drift and void formation in the device that finally limits the cyclability of the memory cells. In order to address these issues, other elements including nitrogen12, oxygen13, silicon14, tin15, carbon6, and tungsten16 as well as oxides such as SiO 2 17and Ta 2 O 5 18have been incorporated into the Ge 2 Sb 2 Te 5 material, leading to a higher crystallisation temperature with longer retention times and a reduced residual stress with smaller density change during the phase transition1018.…”