Cu–Sn coatings obtained from pyrophosphate-based electrolytes

Correia, Adriana N.; Façanha, Marcello X.; Lima‐Neto, Pedro de

doi:10.1016/j.surfcoat.2007.01.029

Cited by 47 publications

(41 citation statements)

References 15 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…The morphology of Cu-Sn alloys in the form of spherical grains is well reported in literature 1,27,28 .Other surface morphologies are also reported for Cu-Sn alloys, such as needles 29 and the dendritic morphology 30 . This latter morphology is usually associated with a coating in which the copper ions reduction was favored, decreasing the reduction of tin ions.…”

Section: Morphological Evaluation By Scanning Electron Microscopy (Sem)supporting

confidence: 53%

Cu-Sn Coatings Produced Using Environmentally Non-Aggressive Electrolyte Containing Sodium Tartrate

2017

View full text Add to dashboard Cite

This work proposes the production of Cu-Sn alloy coatings with anticorrosive properties, using an environmentally non-aggressive bath. The coatings were electrodeposited on carbon steel substrate AISI 1020 using an electrolyte containing CuCl 2 and SnCl 2 , and sodium tartrate as the complexant agent. The produced coatings were characterized by scanning electron microscopy (SEM), X-ray diffraction (XRD), inductively coupled plasma optical emission spectrometry (ICPOES) and electrochemical impedance spectroscopy (EIS). The film showing the highest corrosion resistance was obtained using j = 100 Am -2 . This coating was composed by 95.18 % m/m Cu and 4.83 % m/m Sn, and presented a uniform surface, without defects and small grain sizes. These characteristics probably contributed to the formation of Cu-Sn protective film onto steel substrate from a tartrate bath.

show abstract

Section: Morphological Evaluation By Scanning Electron Microscopy (Sem)supporting

confidence: 53%

Cu-Sn Coatings Produced Using Environmentally Non-Aggressive Electrolyte Containing Sodium Tartrate

2017

View full text Add to dashboard Cite

show abstract

“…The excess TEA in the free state in the solution or the newly formed coordination compounds CuTEA(OH) 2 or Cu(HEDPA)(TEA)(OH) can be adsorbed on the surface of the electrode. Such adsorptions can increase the copper reduction overpotential, thus inhibits the growth of the crystal nucleus of primary copper and promotes the formation of new crystal nucleus, and finally makes the surface of the copper deposition layer smooth and dense.…”

Section: Discussionmentioning

confidence: 99%

“…appear. In the alkaline system, these three oxidation peaks A1, A2, and A3 are ascribed to the formations of Cu 2 O, CuO, and CuO/Cu(OH) 2 , respectively.…”

Section: Methodsmentioning

confidence: 99%

Mechanisms of Triethanolamine on Copper Electrodeposition from 1-Hydroxyethylene-1,1-diphosphonic Acid Electrolyte

Zheng¹,

Chen²,

Cai³

et al. 2017

J. Electrochem. Soc.

View full text Add to dashboard Cite

The effect of triethanolamine (TEA) as a second ligand was studied on the electrodeposition of copper in 1-hydroxyethylene-1,1-diphosphonic acid (HEDPA) electrolyte. The electrochemical behavior of copper deposition was investigated by cyclic voltammetry and electrochemical impedance spectroscopy. The introduction of TEA suppresses the electrodeposition of the copper and promotes the dissolution of copper anode, resulting in fine grains and smooth bright deposits. The “Coordination–Adsorption” theory was proposed to explain the mechanism of action of TEA. The introduction of TEA in the HEDPA electrolyte induces the formation of the CuTEA(OH)2 coordination compounds. The formed CuTEA(OH)2 coordination compounds adsorb on the electrode surface and inhibit the growth of the copper crystal nucleus.

show abstract

“…CU-SN alloys and alloy powders have a wide range of applications in industry, including bearings, self-lubricating bearings, filters and structural parts, [1,2] microelectronic applications, [3,4] anode materials in specific electrochemical reactions, [4] and lithium batteries. [5][6][7][8] Alloy powders with specific properties can be obtained by electrochemical deposition.…”

Section: Introductionmentioning

confidence: 99%

“…The cyanide baths are used frequently in commercial electrodeposition of Cu-Sn alloys and give high-quality deposits, but they cause environmental problems related to the use and disposal of cyanide. [4,[17][18][19] Citrate, thiocyanate, tartrate, and pyrophosphate baths are used for Cu-Sn electroplating, but these electrolytes have several drawbacks and safe alternatives have been sought. [4,15,20] Nevertheless, tripolyphosphate (TPP) electrolytes that have already been employed for electroplating of high-quality bronze coatings are suitable for Cu-Sn powder electrodeposition.…”

Section: Introductionmentioning

confidence: 99%

Response Surface Modeling and Evaluation of the Influence of Deposition Parameters on the Electrolytic Cu-Sn Alloy Powders Production

Orhan

Gezgin

2011

Metall Mater Trans B

View full text Add to dashboard Cite

In this article, the electrodeposition process of Cu-Sn alloy powders from tripolyphosphate (TPP)-based electrolytes was investigated as a function of deposition parameters. The effects of deposition parameters such as current density, electrolyte composition (Cu/Sn mole ratio), mechanical stirring speed, and temperature on the Cu content of alloy powder and cathodic current efficiency were evaluated using the response surface methodology (RSM). The empirical models developed in terms of deposition parameters were found to be statistically adequate to describe the process responses. The study revealed that as far as the copper content was concerned in the alloyed powders, all parameters selected had positive correlations. However, a high stirring speed and low current density led to a greater current efficiency. The morphology and chemical composition of the electrodeposited Cu-Sn alloy powders were investigated using scanning electron microscopy (SEM), energy-dispersive X-ray spectroscopy (EDS), X-ray diffraction (XRD), and inductively coupled plasma (ICP) analysis. An SEM analysis showed that the powder morphology was affected considerably by the cathodic current density and stirring speed.

show abstract

Cu–Sn coatings obtained from pyrophosphate-based electrolytes

Cited by 47 publications

References 15 publications

Cu-Sn Coatings Produced Using Environmentally Non-Aggressive Electrolyte Containing Sodium Tartrate

Cu-Sn Coatings Produced Using Environmentally Non-Aggressive Electrolyte Containing Sodium Tartrate

Mechanisms of Triethanolamine on Copper Electrodeposition from 1-Hydroxyethylene-1,1-diphosphonic Acid Electrolyte

Response Surface Modeling and Evaluation of the Influence of Deposition Parameters on the Electrolytic Cu-Sn Alloy Powders Production

Contact Info

Product

Resources

About