Current-crowding-induced electromigration failure in flip chip solder joints

Abstract

Characterization of thermal stresses in through-silicon vias for three-dimensional interconnects by bending beam technique Appl. Phys. Lett. 100, 041901 (2012) Electrical test method using high density plasmas for high-end printed circuit boards Rev. Sci. Instrum. 83, 013503 (2012) Voltage polarity effects in Ge2Sb2Te5-based phase change memory devices J. Appl. Phys. 110, 054501 (2011) Scaling of reliability of gold interconnect lines subjected to alternating current Appl. Phys. Lett. 99, 011910 (2011) Additional information on Appl. Phys. Lett.

Electric current-driven migration of electrically neutral particles in liquids

“…It has been known that the electric current causes electromigration. [5][6][7][8] The force in the electromigration comes from the momentum transfer from the conducting electrons to atoms. The direction of electromigration force is opposite to that of the electric field.…”

Electromigration Behavior of through-Si-via (TSV) Interconnect for 3-D Flip Chip Packaging

“…The simulation of current distribution in the solder bump of the flip chip structure showed that the current density in the current crowded region is much higher than the averaged current density inside the solder bump. 20) During the initial current stressing, the void quickly propagated and became significantly larger while new voids were formed in the right region of the right-side solder bump. Following void formation, the electron flows were diverted to the left and right sides of the void, causing the void to grow in these directions.…”

“…[1][2][3] Of these benefits, the most valuable advantage for the recent trends of electronic products toward powerful multi-functionality and miniaturization, is the highest I/O capability. Because of this capability, the 3-D flip chip package has been widely adapted in the electronic industries.…”

Corrosion resistance of Pb-free and novel nano-composite solders in electronic packaging

“…The conventional solder technology may not guarantee the required performance at such pitches due to characteristics such as higher diffusivity and softening [12]. In order to solve these problems, efforts have been made to develop new Pb-free solders with a low melting point, good mechanical properties, better microstructure properties, and high creep resistance.…”