“…There are many methods that have been demonstrated to reduce the threading dislocation density of InP or GaAs on Si substrates: using a two-step growth method [18], growing a thicker InP buffer layer [19], using a short-period strained superlattice (e.g. GaAs/InAs) in the buffer layer, growing on patterned Si substrate [20], localized epitaxy overgrowth, or treating the buffer layer with ex situ or in situ thermal annealing [21]. Thermal annealing effectively reduces threading dislocation densities both in InP and GaAs epitaxial layers grown on Si by annihilation and coalescence of dislocations, which are caused by dislocation movement under the thermal stress induced by annealing [22].…”