1994
DOI: 10.1016/0022-0248(94)91069-3
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Defect reduction in GaAs and InP grown on planar Si(111) and on patterned Si(001) substrates

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Cited by 40 publications
(21 citation statements)
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“…On Si (1 1 1) surfaces, a hexagonal interfacial misfit dislocation network may consist of partial dislocations [6][7][8]. In Fig.…”
Section: Resultsmentioning
confidence: 99%
“…On Si (1 1 1) surfaces, a hexagonal interfacial misfit dislocation network may consist of partial dislocations [6][7][8]. In Fig.…”
Section: Resultsmentioning
confidence: 99%
“…Si(111) substrates were used because the most flat and the most dislocation-free epilayer can be obtained on this orientation [3,7]. The SiO 2 layers were obtained by thermal oxidation of Si substrate with 100 nm thickness.…”
Section: Methodsmentioning
confidence: 99%
“…There are many methods that have been demonstrated to reduce the threading dislocation density of InP or GaAs on Si substrates: using a two-step growth method [18], growing a thicker InP buffer layer [19], using a short-period strained superlattice (e.g. GaAs/InAs) in the buffer layer, growing on patterned Si substrate [20], localized epitaxy overgrowth, or treating the buffer layer with ex situ or in situ thermal annealing [21]. Thermal annealing effectively reduces threading dislocation densities both in InP and GaAs epitaxial layers grown on Si by annihilation and coalescence of dislocations, which are caused by dislocation movement under the thermal stress induced by annealing [22].…”
Section: Gainas/inp Qwip Grown On Simentioning
confidence: 99%