2018
DOI: 10.1063/1.5011242
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Defects induced by solid state reactions at the tungsten-silicon carbide interface

Abstract: Defects introduced by the solid state reactions between tungsten and silicon carbide have been studied using deep level transient spectroscopy (DLTS) and Laplace DLTS. W/4H-SiC Schottky barrier diodes were isochronally annealed in the 100–1100 °C temperature range. Phase composition transitions and the associated evolution in the surface morphology were investigated using x-ray diffraction (XRD) and scanning electron microscopy (SEM). After annealing at 1100 °C, the E0.08, E0.15, E0.23, E0.34, E0.35, E0.61, E0… Show more

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Cited by 11 publications
(3 citation statements)
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“…DLTS measures the capacitance of a reverse biased p-n junction, Schottky barrier diode or MOS device due to the emission of carriers by defects in the depletion region. DLTS is one of the most sensitive techniques, as it has the ability to detecting defects at such low concentrations and measures their electronic properties [85,87].…”
Section: Deep-level Transient Spectroscopy (Dlts)mentioning
confidence: 99%
“…DLTS measures the capacitance of a reverse biased p-n junction, Schottky barrier diode or MOS device due to the emission of carriers by defects in the depletion region. DLTS is one of the most sensitive techniques, as it has the ability to detecting defects at such low concentrations and measures their electronic properties [85,87].…”
Section: Deep-level Transient Spectroscopy (Dlts)mentioning
confidence: 99%
“…Several techniques have been used to produce WC layers, such as magnetron sputtering [55], mixing W and C plasma streams [56] or evaporation [57]. Indeed, the difficulty to obtain pure carbide films relies on the high affinity of WC for oxygen, which can often be revealed inside the deposited WC films [37,58,59]. Instead, the oxygen edge could not be detected in the EELS spectra collected in the WC layer annealed at 800 • C. A possible explanation can be found in the diffusion of the oxygen toward the surface and AlGaN interfaces during the annealing treatment at a very high temperature (800 • C).…”
Section: Resultsmentioning
confidence: 99%
“…Numerous PFC concept studies are currently underway due to the good compatibility between W-SiC (in terms of thermal expansion, bonding technology and operating temperature window) [ 86 , 87 ]. The development of technology to join SiC/SiC with itself or with other materials is essential for their integration into various nuclear applications.…”
Section: Structural Materialsmentioning
confidence: 99%