2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and 2023
DOI: 10.1109/eurosime56861.2023.10100821
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Deformation analysis of QFN packages for validation of thermo-mechanical finite element simulations

Chinmay Nawghane
1
,
Thomas Moncond’Huy2,
Bart Vandevelde
3
et al.
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Cited by 4 publications
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Thermal Resistance Modeling to Analyze and Simulate of Quad Flat No-Leads Packaging on Printed Circuit Board by Using ANSYS

Fu,
Huang,
Zhang
2024
2024 IEEE 7th International Electrical and Energy Conference (CIEEC)
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Thermal Resistance Modeling to Analyze and Simulate of Quad Flat No-Leads Packaging on Printed Circuit Board by Using ANSYS

Fu,
Huang,
Zhang
2024
2024 IEEE 7th International Electrical and Energy Conference (CIEEC)
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0
0
0
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Thermal Analysis and Simulation of Quad Flat No-Leads Packaging on Printed Circuit Board with ANSYS

Fu,
Huang,
Zhang
2023
2023 IEEE 7th Conference on Energy Internet and Energy System Integration (EI2)
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Effect of potting on the solder joint reliability of QFN packages under thermal cycling load

Nawghane,
Vandevelde,
Vanderstraeten
et al. 2024
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
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