2018 IEEE Symposium on VLSI Technology 2018
DOI: 10.1109/vlsit.2018.8510643
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Dependence of Reliability of Ferroelectric HfZrO<inf>x</inf> on Epitaxial SiGe Film with Various Ge Content

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Cited by 4 publications
(3 citation statements)
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“…A p-type epi-GeSn with 5% Sn/epi-Ge/Si substrate was used as the starting material for the fabrication of FeCAPs where the epi-GeSn and epi-Ge were formed by solid-phase epitaxy and rapid thermal chemical vapor deposition, respectively. Then, HZO of 12 nm was deposited on the epi-GeSn film by the plasma-enhanced ALD process tool. , Next, FeCAPs were complete by depositing and patterning with 100 × 100 μm 2 TiN metal followed by RTA (500 °C/30 s) to induce ferroelectricity (denoted as STD-FeCAPs). To improve the interface quality between HZO and epi-GeSn, an interface engineering by depositing a high- k AlON IL of 1.2 nm was performed by the ALD process prior to HZO deposition on some samples (denoted as AlON-FeCAPs), where AlON allows more voltage drop on HZO and enhances reliability .…”
Section: Methodsmentioning
confidence: 99%
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“…A p-type epi-GeSn with 5% Sn/epi-Ge/Si substrate was used as the starting material for the fabrication of FeCAPs where the epi-GeSn and epi-Ge were formed by solid-phase epitaxy and rapid thermal chemical vapor deposition, respectively. Then, HZO of 12 nm was deposited on the epi-GeSn film by the plasma-enhanced ALD process tool. , Next, FeCAPs were complete by depositing and patterning with 100 × 100 μm 2 TiN metal followed by RTA (500 °C/30 s) to induce ferroelectricity (denoted as STD-FeCAPs). To improve the interface quality between HZO and epi-GeSn, an interface engineering by depositing a high- k AlON IL of 1.2 nm was performed by the ALD process prior to HZO deposition on some samples (denoted as AlON-FeCAPs), where AlON allows more voltage drop on HZO and enhances reliability .…”
Section: Methodsmentioning
confidence: 99%
“…Then, HZO of 12 nm was deposited on the epi-GeSn film by the plasma-enhanced ALD process tool. 35,36 Next, FeCAPs were complete by depositing and patterning with 100 × 100 μm 2 TiN metal followed by RTA (500 °C/30 s) to…”
Section: ■ Experimental Sectionmentioning
confidence: 99%
“…[6][7][8][13][14][15]. Therefore, the benchmarking comparison within different works can be misleading due to the inconsistent pulsing schemes.…”
mentioning
confidence: 99%