R. KUMAR and R. J. PUDDEPHATT. Can. J. Chem. 69, 108 (1991).The q-cyclopentadienyl (Cp) and q-ally1 (C3H5) complexes [RhCp(C0)2], [RhCp(cod)] where cod = 1,5-cyclooctadiene, [Rh(q-C3H5)(CO),], and [ R h (~l -c~H~)~] have been shown to be useful precursors for the chemical vapour deposition (CVD) of rhodium films. The rhodium films contain carbon impurities but these can be greatly reduced if CVD is carried out in the presence of hydrogen. The films adhere well to a silicon substrate. Xntroduction There has been much recent interest in the formation of thin films of metals using chemical vapour deposition, CVD (1-3). These films have applications in microelectronics, optical devices, wear protection, and catalysis (4). Advantages of CVD include its ease of use, mild conditions of formation, and high performance of the films. Challenges for chemists include the design and synthesis of volatile precursors which decompose to the desired materials in pure form and under mild thermal or photochemical conditions as required for specific applications, and the determination of the mechanisms of CVD to enable the development of a rational approach to precursor design.Most recent research has been focussed on CVD of gold, palladium, and platinum, noble metals most commonly used in microelectronics (5-9). Rhodium has been much less extensively studied (2, 10). Rhodium films are used in mirror optics, catalysis, and wear protection but, while rhodium has excellent electrical properties and corrosion resistance, its high cost has so far limited its application in microelectronics (11). This paper surveys, some volatile organorhodium complexes, and reports on a study of thermal CVD of rhodium films from these compounds. Other researchers have reported CVD of rhodium using the precursors [Rh2 (
Results and discussionIn this work, the new precursors used were the -q-cyclopentadienyl derivatives [RhCp(cod)] , Cp = p-C5H5, cod = 1 3 -cyclooctadiene, and [RhCp(CO)2] and the q-ally1 derivatives [Rh(q-C3H5)(C0)2] and [Rh(q-C3H5)3]. All were prepared by known procedures (12-15). For reference, some CVD experiments were also carried out with the known precursor [Rh2 t F-C~)Z(CO),] (2).
Formation and characterization of rhodium jlmsIn a typical reaction, CVD was carried out in a vertical reactor operating at 10-2-10-3 Torr. The substrate was a silicon wafer, which was heated to 130-270°C. Under these conditions, highly reflective rhodium films were formed and the film thickness typically grew at a rate of -2 pm/h. The films were analyzed by XPS and some typical data are given in Table 1.The rhodium films are rapidly contaminated by exposure to the atmosphere and, in all cases, the films were cleaned before analysis by argon sputtering for 30 s. Even so, the films consistently contained much carbon and oxygen impurities. These impurities were greatly reduced when the CVD was carried out using hydrogen carrier gas (Table 1). For example, using only ~o r r Hz as carrier gas and [Rh(p-C3H5)(CO)2] as precursor, the rhodium content increased...