2012
DOI: 10.1016/j.snb.2012.07.096
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Design and electrochemical preparation of inductive copper coils for magnetic particles detection

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Cited by 5 publications
(2 citation statements)
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“…For application in Micro-Electromechanical Systems (MEMS) technologies, thin films and coatings must have good adhesion to the substrate, good corrosion resistance and good wear resistance, while maintaining satisfactory mechanical properties [3][4][5][6][7]. In MEMS technologies, the processes of the formation of uniform and compact Cu films and coatings are applied in the production of inductive copper micro-coils for magnetic particles detection [8], in combination with micro-machining techniques to obtain micro-gear [9], for wiring on printed circuit boards (PCBs) and bottom-up filling or superfilling techniques for fabrication of Through Silicon Via (TSV) structures [10]. In addition, copper coatings are used as sacrificial layers for the production of different laminar composite structures [11].…”
Section: Introductionmentioning
confidence: 99%
“…For application in Micro-Electromechanical Systems (MEMS) technologies, thin films and coatings must have good adhesion to the substrate, good corrosion resistance and good wear resistance, while maintaining satisfactory mechanical properties [3][4][5][6][7]. In MEMS technologies, the processes of the formation of uniform and compact Cu films and coatings are applied in the production of inductive copper micro-coils for magnetic particles detection [8], in combination with micro-machining techniques to obtain micro-gear [9], for wiring on printed circuit boards (PCBs) and bottom-up filling or superfilling techniques for fabrication of Through Silicon Via (TSV) structures [10]. In addition, copper coatings are used as sacrificial layers for the production of different laminar composite structures [11].…”
Section: Introductionmentioning
confidence: 99%
“…Various processes of copper electrodeposition on different bulk materials were devel-oped for micro electro mechanical systems devices (MEMS), through-hole plating for printed circuit boards (PCBs), as well as for all other conventional functional plating processes on silicon, brass, steel, copper, etc. [3][4][5]. Copper coatings are the most commonly used material for interconnections within microelectronics.…”
Section: Introductionmentioning
confidence: 99%