2020 42nd Annual International Conference of the IEEE Engineering in Medicine &Amp; Biology Society (EMBC) 2020
DOI: 10.1109/embc44109.2020.9175440
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Design and microfabrication strategies for thin-film, flexible optical neural implant

Abstract: Advanced polymer science and design technologies are constantly evolving to meet ever-growing expectations for flexible optical MEMS. In this work, we present design and microfabrication considerations for designed flexible Polymeric Opto-Electro-Mechanical Systems (POEMS). The presented methods integrate waveguide fabrication and laser diode (LD) chip assembly with Lawrence Livermore National Laboratory's (LLNL's) flexible thin-film technology to enable LLNL's first neural optoelectrode that can deliver guide… Show more

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Cited by 4 publications
(2 citation statements)
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“…Today, PI is already a very mature material and widely available in various forms (Liang et al, 1992 ; Rousche et al, 2001 ; Hassler et al, 2011 ; Bakonyi et al, 2013 ; Kim et al, 2013 ). PI has a great potential for a variety of applications in neural implants (Mian et al, 2005 ; Rubehn and Stieglitz, 2010 ; Viventi et al, 2011 ; Schaubroeck et al, 2017 ; Kampasi et al, 2020 ), such as multi-level interconnects, multi-chip module packaging, and flexible circuitry (Frazier, 1995 ). Compared with PA, PI provides better high-temperature stability (up to 400°C), higher glass transition temperature (Kim and Meng, 2015 ), better dielectric properties (Frazier, 1995 ), and lower moisture absorption.…”
Section: Packaging and Substrate Materialsmentioning
confidence: 99%
“…Today, PI is already a very mature material and widely available in various forms (Liang et al, 1992 ; Rousche et al, 2001 ; Hassler et al, 2011 ; Bakonyi et al, 2013 ; Kim et al, 2013 ). PI has a great potential for a variety of applications in neural implants (Mian et al, 2005 ; Rubehn and Stieglitz, 2010 ; Viventi et al, 2011 ; Schaubroeck et al, 2017 ; Kampasi et al, 2020 ), such as multi-level interconnects, multi-chip module packaging, and flexible circuitry (Frazier, 1995 ). Compared with PA, PI provides better high-temperature stability (up to 400°C), higher glass transition temperature (Kim and Meng, 2015 ), better dielectric properties (Frazier, 1995 ), and lower moisture absorption.…”
Section: Packaging and Substrate Materialsmentioning
confidence: 99%
“…Recently, flexible polymer-based neural probes have been reported [ 37 , 38 ]. Advantages of the flexible polymer-based neural probes over the rigid silicon-based neural probes include low elastic modulus, good biocompatibility, and low mechanical mismatch.…”
Section: Introductionmentioning
confidence: 99%