1995
DOI: 10.1108/eb044033
|View full text |Cite
|
Sign up to set email alerts
|

Design and Procurement of Eutectic Sn/Pb Solder‐bumped Flip Chip Test Die and Organic Substrates

Abstract: If you would like to write for this, or any other Emerald publication, then please use our Emerald for Authors service information about how to choose which publication to write for and submission guidelines are available for all. Please visit www.emeraldinsight.com/authors for more information. About Emerald www.emeraldinsight.comEmerald is a global publisher linking research and practice to the benefit of society. The company manages a portfolio of more than 290 journals and over 2,350 books and book series … Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

0
0
0

Year Published

1996
1996
1999
1999

Publication Types

Select...
3
2

Relationship

0
5

Authors

Journals

citations
Cited by 6 publications
references
References 1 publication
(1 reference statement)
0
0
0
Order By: Relevance