The mechanical and thermal responses of encapsulated flip chip solder bumps on a surface laminar circuit (SLC) board have been determined in this study. The mechanical responses of the solder bumps and encapsulant have been obtained by shear, tension and torsion tests. The thermal stress and strain in the solder bumps and encapsulant have been determined by a non‐linear finite element method and the thermal fatigue life of the corner solder bump is then estimated based on the calculated plastic strains, Coffin‐Manson law and isothermal fatigue data of solders. Also, an assembly process of the test boards is presented.

If you would like to write for this, or any other Emerald publication, then please use our Emerald for Authors service information about how to choose which publication to write for and submission guidelines are available for all. Please visit www.emeraldinsight.com/authors for more information. About Emerald www.emeraldinsight.comEmerald is a global publisher linking research and practice to the benefit of society. The company manages a portfolio of more than 290 journals and over 2,350 books and book series volumes, as well as providing an extensive range of online products and additional customer resources and services.Emerald is both COUNTER 4 and TRANSFER compliant. The organization is a partner of the Committee on Publication Ethics (COPE) and also works with Portico and the LOCKSS initiative for digital archive preservation.ABSTRACT -A case study was conducted to investigate the issues associated with the design and procurement of flip chip test die and corresponding organic substrates. Test wafers were fabricated by an IC supplier and bumped with electroplated eutectic Sn/Pb by a third party. Issues associated with transferring integrated circuit data to printed circuit design software were identified. The bare and bumped wafers were characterised to identify possible criteria for lot qualification.

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