Design and testing of a kinematic package supporting a 32×32 array of GaAs MQW modulators flip-chip bonded to a CMOS chip

Ayliffe, Michael H.; Rolston, D.R.; Chuah, Alan E. L.; Bernier, Éric; Michael, F.S.J.; Kabal, D.; Kirk, Andrew G.; Plant, David V.

doi:10.1109/50.956142

Cited by 6 publications

(4 citation statements)

References 31 publications

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“…Using great care, by spending a lot of time, and by using positioners and holders of high accuracy and precision, we can reduce the offsets but we cannot eliminate them totally [4,6,7,13,14]. There can be six possible offsets in the alignment of linear arrays.…”

Section: Effects Of Misalignments Between Two Linear Arraysmentioning

confidence: 97%

“…Monte-Carlo simulation based calculation of the effects of misalignments is discussed in a recent paper [6]. Experimental calculations on the power loss owing to misalignments are reported in [7]. Our paper presents simple analytical formulas useful for a quick design of array-based parallel optical system packages and estimation of overall system performances.…”

Section: Introductionmentioning

confidence: 97%

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Effects of misalignments in packaging of array-based optical interconnects and processors

Ghosh

2003

Optical Information Systems

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Parallel optical interconnections which replace metallic transmission lines with optical fibers or free space channels provide high throughput, easy system integration, and low latency. These systems are used in making multiprocessor based supercomputers, telecommunication exchange switches and terminals, optical information processors and computers. A first-order model for the decrease in coupling efficiency between elements of two linear arrays of a free-space, parallel optical interconnect owing to misalignments or offsets in packaging is developed. Such an array interconnect consists of an array of optical sources, such as, optical fibers or VCSELs and an array of photo-receptors, such as, optical fibers, micromirrors or photodetectors. The coupling efficiency between source and receptor elements is modeled in terms of the sizes of the array elements, inter-element spacing and distances. The coupling efficiency is subject to degrading influence of six varieties of random offsets, which may occur during the alignment, and fixing of the two arrays in a package. We then determine first order approximations of the effects of these offsets. Our paper presents simple analytical formulas useful for a quick design of array-based parallel optical system packages and estimation of overall system performances. The formulas developed are useful for design and packaging of any optoelectronic processing system.

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Section: Effects Of Misalignments Between Two Linear Arraysmentioning

confidence: 97%

Section: Introductionmentioning

confidence: 97%

Effects of misalignments in packaging of array-based optical interconnects and processors

Ghosh

2003

Optical Information Systems

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“…These angles correspond to the entrance and exit numerical apertures (NA) of the module. Within the laws of geometrical optics, it can be shown that the following relationship is true at all points within an optical system [39]: (10) This is referred to as the optical invariant. We can now relate this to the misalignment product.…”

Section: Optical Invariant and Misalignment Tolerancementioning

confidence: 99%

“…These rules have emerged after implementing a series of optical interconnect demonstrator systems and subsystems, including a 512 channel optical ring interconnect [3], [4], a 512 channel bidirectional interconnect [5], [6], a 1080 element OE-VLSI chip which implements a variety of data transmission protocols [7], [8] and a highly misalignment tolerant interconnect that makes use of spatial redundancy [9]. We have also implemented a range of alignment and assembly schemes [10]- [12] and performed analyses of misalignment tolerance [13], [14] and scalability for free-space optical interconnects [15]- [17]. In this paper, we also consider the published results of other researchers in order to obtain a complete a picture as possible of the issues involved in FSOI design and implementation.…”

mentioning

confidence: 99%

Design rules for highly parallel free-space optical interconnects

Kirk

Plant

Ayliffe

et al. 2003

IEEE J. Select. Topics Quantum Electron.

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Recently, a number of successful free-space chip-to-chip and board-to-board optical interconnects have been demonstrated. Here, we present some of the design rules that can be derived as a result of this work and also as a result of numerical and theoretical analyzes. We draw a number of conclusions. In the area of optoelectronic very large scale integration (VLSI) design, we suggest that differential electrical and optical transceiver designs provide the best performance. In the area of optical design, we present scaling and system partitioning laws for clustered optical relays and determine the interconnect distances at which microlens or macrolens systems are more suitable. We also show that the ease with which two modules can be aligned can be related to the optical invariant of the system and is, thus, a function of the size of the detector and the numerical aperture of the detector optics. Finally, we show that when multiple optical components must be aligned, very high individual component tolerances are required if the system as a whole is to have a high chance of success.

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Six-degrees-of-freedom alignment of two-dimensional array components by use of off-axis linear Fresnel zone plates

et al. 2001

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A novel six-degrees-of-freedom (six-DOFs) alignment technique for assembling two-dimensional array components is presented. The technique uses off-axis linear Fresnel zone plates on one component that are combined with alignment targets on the other. The technique is compact and sensitive to all six DOFs; it was used to package an array of microlenses with a 32 x 32 array of GaAs multiple-quantum-well modulators flip-chip bonded to a 9 mm x 9 mm complementary-metal-oxide-semiconductor chip. By use of interference fringes to control the tilt misalignment, the worst-case misalignment of the microlenses relative to the chip is calculated to be as follows: lateral = 3.0 mum, rotational = 0.023 degrees , longitudinal = 13 mum, and tilt = 0.022 degrees . We also propose alternative implementations of the technique, including one that uses on-chip photodetectors to automate this six-DOF alignment technique.

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Design and testing of a kinematic package supporting a 32×32 array of GaAs MQW modulators flip-chip bonded to a CMOS chip

Cited by 6 publications

References 31 publications

Effects of misalignments in packaging of array-based optical interconnects and processors

Effects of misalignments in packaging of array-based optical interconnects and processors

Design rules for highly parallel free-space optical interconnects

Six-degrees-of-freedom alignment of two-dimensional array components by use of off-axis linear Fresnel zone plates

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