2015
DOI: 10.2991/amcce-15.2015.304
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Design of Analysis Platform Used for Studying Soft Error Characteristic of 3D SRAM

Abstract: This paper designs a novel 3D SRAM soft error analysis platform. It is used for studying the soft error characteristic of 3D SRAM stacked by multi dies and guiding the radiation hardened design for 3D SRAM. This platform integrates simulation tools including Geant4, TCAD and Nanosim, data recording and processing tools ROOT, layout processing tools Calibre, and Perl and Shell script used for linking task and analyzing results. After inputting the stacked structure, technology, circuit netlist and layout of 3D … Show more

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Cited by 4 publications
(3 citation statements)
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“…Several pieces of research have been conducted to investigate the soft error caused by the radiation effect. Li et al and Mahyuddin et al introduced a strike at the circuit node with a transient current source to emulate SEU [ 2 ]. Similarly, the SEU effect in III-V Hetero-junction TFET, III-V FinFET and Si FinFET have been investigated using circuit simulation [ 3 ].…”
Section: Introductionmentioning
confidence: 99%
“…Several pieces of research have been conducted to investigate the soft error caused by the radiation effect. Li et al and Mahyuddin et al introduced a strike at the circuit node with a transient current source to emulate SEU [ 2 ]. Similarly, the SEU effect in III-V Hetero-junction TFET, III-V FinFET and Si FinFET have been investigated using circuit simulation [ 3 ].…”
Section: Introductionmentioning
confidence: 99%
“…In a radiation environment such as space, radiation particle (e.g., alpha particles, protons, neutrons, or other heavy ions) causes a decrease in critical charge and capacitance of SRAM, thus more susceptible to Single Event Upset (SEU) [1]. An electron-hole pair is generated along the path of a charged particle in a [2]. Similarly, the SEU effect in III-V Hetero-junction TFET, III-V FinFET and Si FinFET are investigated using circuit simulation [3].…”
Section: Introductionmentioning
confidence: 99%
“…The collected charge (Q coll ) of electron-hole pair can change the state of the memory cell, register, latch or flip flops, only if it is greater than the critical charge (Q crit ), which is the minimum charge required to trigger a change in the data state [1], [2]. Simulation of SEU can be performed with either the circuit simulators such as SPICE [3]- [5], or drift-diffusion finite element device simulators [6]- [8]. Circuit simulators have the advantage of being computationally efficient than device simulators.…”
Section: Introductionmentioning
confidence: 99%