2006
DOI: 10.1063/1.2364043
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Determination of capture cross sections for as-grown electron traps in HfO2∕HfSiO stacks

Abstract: A major challenge for replacing gate SiON with HfO2 is the instability and reliability of HfO2. Unlike the SiON, there can be substantial amount of as-grown electron traps in HfO2. These traps can cause instability in the threshold voltage and contribute to the dielectric breakdown. Despite the early efforts, our understanding of them is incomplete. Agreement on their capture cross sections has not been reached and the reported values spread in a large range of 10−12–10−19cm2. The objective of this paper is to… Show more

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Cited by 51 publications
(49 citation statements)
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“…The discharge is driven mainly by Vdis and there is little difference when time increases from 1 to 1000 sec. This agrees well with early works that carrier tunneling completes in seconds for thin dielectric [12,18]. Unless stated otherwise, a discharge time of 100 sec was used.…”
Section: Devices and Experimentssupporting
confidence: 70%
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“…The discharge is driven mainly by Vdis and there is little difference when time increases from 1 to 1000 sec. This agrees well with early works that carrier tunneling completes in seconds for thin dielectric [12,18]. Unless stated otherwise, a discharge time of 100 sec was used.…”
Section: Devices and Experimentssupporting
confidence: 70%
“…One may speculate that the barrier between the two wells is negligible, as illustrated in Fig. 13(c), so that charging rate is controlled by carrier fluency, similar to fill the generated traps in SiO2 [28] and as-grown shallow electron traps above Si Ec in early HK stacks [12], where saturation is reached rapidly.…”
Section: Cyclic and Anti-neutralization Ets Model (Cam)mentioning
confidence: 99%
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“…A principle for developing a model is to minimize the number of fitting parameters, because this reduces the risk that a good agreement between a model and test data is just a result of 'curve-fitting' [34,35]. The AG model in eqn.…”
Section: B Experimental Separation Of the Two Componentsmentioning
confidence: 99%
“…Degradation occurs through several mechanisms, including negative [7][8][9][10] and positive [11,12] bias temperature instability (NBTI and PBTI), hot carrier stresses [13], and oxide wearout and breakdown [14]. This work focuses on NBTI, which is limiting the lifetime of pMOSFETs.…”
Section: Introductionmentioning
confidence: 99%