2007
DOI: 10.1016/j.physc.2007.04.278
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Development of 22.9kV high-temperature superconducting cable for KEPCO

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Cited by 8 publications
(4 citation statements)
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“…During the bonding process, a certain area of superconducting cores is exposed as a joining window by etched with a mixture of NH 3 The thermal circle in diffusion bonding process is shown in Fig. 4.…”
Section: Methodsmentioning
confidence: 99%
See 1 more Smart Citation
“…During the bonding process, a certain area of superconducting cores is exposed as a joining window by etched with a mixture of NH 3 The thermal circle in diffusion bonding process is shown in Fig. 4.…”
Section: Methodsmentioning
confidence: 99%
“…Meanwhile, many application projects of the HTS tapes have been also studied by some researchers [3][4][5][6], such as power transition, energy storage and NMR magnet applications in where the bonding technology was usually needed to obtain interconnections between various parts of superconducting apparatus, both electrical and mechanical properties are required for the joint.…”
Section: Introductionmentioning
confidence: 99%
“…Following these tests, the acceptance test was conducted with the rated ground voltage of 13.2 kV and a nominal current of 1250 A for 48 h, successfully [8].…”
Section: Kepco Projectmentioning
confidence: 99%
“…According to the literature (for example [3,4], etc.) in the existing short HTS power transmission lines temperature difference between outlet and inlet (¨T) is less than 2 K while maintaining a moderate circulation rate of the LN 2 .…”
Section: Introductionmentioning
confidence: 99%