1998
DOI: 10.1117/12.332823
|View full text |Cite
|
Sign up to set email alerts
|

Development of a next-generation e-beam lithography system

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3

Citation Types

0
3
0

Year Published

2013
2013
2021
2021

Publication Types

Select...
2

Relationship

0
2

Authors

Journals

citations
Cited by 2 publications
(3 citation statements)
references
References 2 publications
0
3
0
Order By: Relevance
“…Direct writing lithographic techniques, including photolithography (x-ray or ultraviolet), scanning probe lithography [7][8][9], and electron or ion-beam lithography [10][11][12], can provide high resolution and flexible machining of polymer materials [13,14]. Among them, direct laser writing methods have gained great attention due to their high spatial resolution and easy implementation, for either single channel or channel array fabrication [15].…”
Section: Introductionmentioning
confidence: 99%
“…Direct writing lithographic techniques, including photolithography (x-ray or ultraviolet), scanning probe lithography [7][8][9], and electron or ion-beam lithography [10][11][12], can provide high resolution and flexible machining of polymer materials [13,14]. Among them, direct laser writing methods have gained great attention due to their high spatial resolution and easy implementation, for either single channel or channel array fabrication [15].…”
Section: Introductionmentioning
confidence: 99%
“…For other EBL systems, such as the variable shaped EB (VSB) systems, and EB projection systems [electron projection lithography (EPL) system and scattering with angular limitation projection electron beam lithography (SCALPEL) system], [6][7][8][9][10][11][12][13][14][15][16][17][18][19][20][21] the Coulomb blurs have always been obstructive. To achieve high writing/exposure throughput, a large I b is needed.…”
Section: Introductionmentioning
confidence: 99%
“…Considering this situation, to obtain both a large I b and a small beam size, EBL (VSB, EPL, and SCALPEL) systems with shortened optical length and/or high acceleration voltage have been developed. 7,8,10,11) In spite of these efforts, VSB, EPL, and SCALPEL systems could not be used as wafer mass production machines because of their small throughput. Currently, multi-electron beam lithography and massively parallel electron beam lithography systems are being researched to solve this problem.…”
Section: Introductionmentioning
confidence: 99%