2019
DOI: 10.1109/jsen.2019.2924256
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Development of a Thermoelectric Energy Generator Chip of Small Layout and High Power/Voltage Factors by Foundry Service

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Cited by 12 publications
(5 citation statements)
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“…This heightened T diff amplifies the thermoelectric effect, leading to increase output voltage and enhance power generation capability. The fabrication process of the MTG is simpler when compared to the methods employed by Huesgen et al [22], Yan et al [24], Chen et al [26], Yuan et al [27] and Yang et al [28]. Moreover, our approach achieves a higher power factor than that reported by Kao et al [23], Yan et al [24], and Chen et al [26].…”
Section: Introductionmentioning
confidence: 69%
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“…This heightened T diff amplifies the thermoelectric effect, leading to increase output voltage and enhance power generation capability. The fabrication process of the MTG is simpler when compared to the methods employed by Huesgen et al [22], Yan et al [24], Chen et al [26], Yuan et al [27] and Yang et al [28]. Moreover, our approach achieves a higher power factor than that reported by Kao et al [23], Yan et al [24], and Chen et al [26].…”
Section: Introductionmentioning
confidence: 69%
“…Additionally, the high thermal resistance poses challenges in certain heat source scenarios. Yang et al [28] presented an MTG chip fabricated using a semiconductor foundry service. This chip incorporated innovative features for enhanced performance, including a polysilicongermanium layer for improved thermoelectric efficiency, an isolation cavity for better thermal insulation, and structural support to enhance TC stability.…”
Section: Introductionmentioning
confidence: 99%
“…Despite its standard limited performances, still, silicon has found applications in microharvesters where its integrability has prevailed over its fair efficiency [ 81 , 82 , 83 , 84 ]. The availability of low-cost, integrated microTEGs is largely considered a key enabling technology supporting the development of the Internet of Things (IoT).…”
Section: Low-temperature Applicationsmentioning
confidence: 99%
“…Prototypes anticipating this path have been recently reviewed by Yan [ 82 ] and Jaziri et al [ 94 ]. Important advances on the route of making integrated TEGs fully compatible with standard microelectronic technologies were presented by Yang et al [ 84 , 95 ]. Differently from most previous implementations [ 81 , 93 ], in this case, the device was designed adapting a well-established BiCMOS (Bipolar Complementary Metal-Oxide-Semiconductor) layout.…”
Section: Low-temperature Applicationsmentioning
confidence: 99%
“…The fabrication of a hybrid µ-TEG is challenging due to the need to create vacuum cavities to eliminate parasitic thermal resistance. Such designs have been explored with CMOS [19] and MEMS-based [20] fabrication setups but with poly-Si and SiGe thin films. The MEMS-based approach relies on wafer bonding as a tool to create vacuum cavities on both sides of the thermoelectric thin films.…”
Section: Introductionmentioning
confidence: 99%