2006
DOI: 10.1016/j.nima.2006.05.011
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Development of an Indium bump bond process for silicon pixel detectors at PSI

Abstract: The hybrid pixel detectors used in the high energy physics experiments currently under construction use a vertical connection technique, the so-called bump bonding. As the pitch below 100 µm, required in these applications, cannot be fullfilled with standard industrial processes (e.g. the IBM C4 process), an in-house bump bond process using reflowed indium bumps was developed at PSI as part of the R&D for the CMS-pixel detector.The bump deposition on the sensor is performed in two subsequent lift-off steps. As… Show more

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Cited by 68 publications
(36 citation statements)
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“…8 /Ωm) could likely be improved significantly by incorporating techniques such as surface passivation, heating, and precise alignment that are standard in industrial bump bonding 21,22 . The RF loss properties of superconducting interconnects and wafer-scale bonds produced with these techniques 23 is a topic of current investigation.…”
Section: Discussionmentioning
confidence: 99%
“…8 /Ωm) could likely be improved significantly by incorporating techniques such as surface passivation, heating, and precise alignment that are standard in industrial bump bonding 21,22 . The RF loss properties of superconducting interconnects and wafer-scale bonds produced with these techniques 23 is a topic of current investigation.…”
Section: Discussionmentioning
confidence: 99%
“…More details are available in [48]. In a first step, photo-lithographic and under-bump-metal (UBM) treatments of ROC and sensor wafers are performed.…”
Section: Bare Module Assemblymentioning
confidence: 99%
“…The origin of the issue of bump-bonding thinned devices is the bowing during the high temperature solder reflow process. An alternative method using indium based connections is being investigated at the Science and Technologies Facilities Council (STFC) and has been used in the construction of the ATLAS and CMS pixel systems [6,7]. Indium bump bonding can be made using room temperature compression or thermo-compression.…”
Section: Bump-bonding For Thinned Module Assemblymentioning
confidence: 99%