Development of integrated 3D radio front-end system-on-package (SOP)

Laskar, J.; Sutono, A.; Lee, C.-H.; Davis, M.F.; Maeng, M.; Lal, N.; Lim, Koeng Su; Pinel, S.; Tentzeris, M. M.; Obatoyinbo, A.

doi:10.1109/gaas.2001.964381

Cited by 19 publications

(8 citation statements)

References 4 publications

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“…According to the actual situation, this paper takes four sets of data for the four variables,H 1 In order to achieve the purpose of the experiment, and reduce the number of experiments, this paper used the orthogonal experimental design method. The method was characterized by simple, convenient calculation table, the user can quickly grasp.…”

Section: Warpage Results Under Different Sizesmentioning

confidence: 99%

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Research of Typical Electronic Package Warpage based on GA

Zhao¹,

Wang²,

Yuan-hua³

2017

Proceedings of the 2nd International Conference on Mechatronics Engineering and Information Technology (ICMEIT 2017)

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Abstract. In order to reduce the warpage value of the electronic package device under the temperature load, improve the reliability of the device. The finite element analysis model of the typical electronic package device was established, and loaded finite element analysis of temperature, obtained the warpage value of the top and middle part of the package structure. 16 different combinations of different parameters were designed by orthogonal design, and the finite element analysis model was established, the corresponding warpage values were obtained and the neural network fitting was carried out. On this basis, the use of genetic algorithm to optimize the material size to achieve the purpose of reducing the amount of warpage. The results showed that the method can greatly reduce the time and ensure accuracy in the package design. And this method provides a new way for the design of the electronic.

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Section: Warpage Results Under Different Sizesmentioning

confidence: 99%

“…Packaging technology was one of the key steps in the development of electronic packaging circuit [1]. In the process of electronic packaging, the changing temperature will result in the warpage of the material, the influencing factors include substrate, bonding layer, chip and packaging material.…”

Section: Introductionmentioning

confidence: 99%

Research of Typical Electronic Package Warpage based on GA

Zhao¹,

Wang²,

Yuan-hua³

2017

Proceedings of the 2nd International Conference on Mechatronics Engineering and Information Technology (ICMEIT 2017)

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“…To achieve this a dielectric resonator antenna is proposed and integrated at package level, which maximizes the use of the available space without compromising the size of the module. Most of the available published solution [3], [6], [10]- [17], are based on planar antenna structures that suffer from low efficiency, reduce bandwidth, and are very prone to detuning. Our previous work [7]- [9] has introduced the concept of package integrated dielectric resonator.…”

Section: A Package Integrated Antennamentioning

confidence: 99%

Implementation of Packaged Integrated Antenna With Embedded Front End for Bluetooth Applications

Rotaru

Lim

Kuruveettil

et al. 2008

IEEE Trans. Adv. Packag.

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Abstract-The design, integration and realization of system in enhanced package approach towards fully functional system level integration by using a compact Bluetooth USB dongle as the demonstrator is presented here. The integration was done on FR4 substrates, which is totally compatible with today's printed circuit board manufacturing capability. A commercially available Bluetooth integrated chip was chosen as the chipset of our demonstrator, and a package integrated antenna together with an embedded front end completes the system in package integration. The front end developed here is based on an embedded meander line combline filter and an embedded transformer balun. The filter has a 35% area reduction when compared with the classical combline filter and similar performance. The balun has the coils distributed on three layers that minimized the board area needed it and optimizes the performances. The proposed packaged integrated antenna approach is successfully demonstrated here and the new module shows excellent performance when compared with a commercial solution, surpassing the normal Bluetooth class II dongle range which is up to 10 m and increasing the module range up to 120 m without an extra power amplifier.Index Terms-Dielectric resonator antenna (DRA), embedded front end, embedded passives, package integrated antenna, system in package (SiP), wireless module.

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“…Recent advances in integration technology and device performance paved the way for higher level of System integration On Chip (SOC) or In Package (SIP) [1]. The new wireless and mobile communication systems use miniature Radio Frequency (RF) module design technologies to satisfy low-cost and compact size.…”

Section: Introductionmentioning

confidence: 99%

Low-cost compact spiral inductor resonator filters for system-in-a-package

Lee

Megahed

Flaviis

2005

IEEE Trans. Adv. Packag.

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In this paper, compact spiral inductor resonators filters, which are embedded in the package substrate, using spiral inductor type resonator are proposed. The design is based on the selfresonance frequency of the spiral inductors and electromagnetic coupling effects among resonators. The filters were built and measurement results have good agreement with the simulation data. The proposed filter design technique is generalized and can be implemented in different multilayer arrangement. The new compact inductor resonator filters exhibit a significant size reduction compared to the existing distributed filter topology. The inductor resonator filter designs are based on full-wave electromagnetic analysis. A lumped element equivalent circuit based on the simulated data of the filter is also derived for integration in SPICE type simulator.The compactness of the newly developed bandpass filter makes the design and integration of bandpass filters attractive for further development and applications in System-In-a-Package (SIP).1

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Development of integrated 3D radio front-end system-on-package (SOP)

Cited by 19 publications

References 4 publications

Research of Typical Electronic Package Warpage based on GA

Research of Typical Electronic Package Warpage based on GA

Implementation of Packaged Integrated Antenna With Embedded Front End for Bluetooth Applications

Low-cost compact spiral inductor resonator filters for system-in-a-package

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