Development of two new thick-film photoresists

Ficner, Stanley A.; Hermanowski, James; Lu, Peng-Han; Kokinda, Elaine; Perez, Yvette M.; Dammel, Ralph R.

doi:10.1117/12.241864

Cited by 5 publications

(2 citation statements)

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“…As a result, deep layers within the film can be exposed in a very short exposure time and the sizing exposure dose (E 1:1 ) only slightly increases upon increasing thickness. In contrast, a novolak photoresist will show a more pronounced thickness dependence of E 1:1 and will require exposure doses a factor of 4 to 10 times larger [1][2][3][4][5].…”

Section: Comparison With a 15µm Thick Dnq / Novolak Resist Processmentioning

confidence: 99%

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Process conditions and lithographic performance of arch durimide polyimides in the ultra-thick film regime

Misat¹,

Pellens

Voets

et al. 2003

SPIE Proceedings

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Polyimides are readily known to possess superior mechanical resistance and adhesion, better chemical inertness in strong acids and bases and, when cured, a higher thermal stability than thick novolak-based resists. They fit well in advanced buffer coat applications to release the mechanical stress between the microchip and the epoxy mould compound and represent promising candidates for recent wafer level packaging developments where they can serve either as interlayer dielectrics or as a mould for solder bumps plating. However, in MEMS fabrication and micromachining they are often perceived as over-engineered for etch processes and as under-performing as to produce high aspect ratio structures for advanced metal plating applications.We optimized coating, exposure and develop conditions for reaching Arch Durimide TM 7500 polyimide layers between 6 and 85 microns thick and investigated their photolithographic performance on the ASML SA 5200/55 stepand-repeat systems. Dense line features were analyzed from extensive focus-exposure matrices and demonstrated very wide process window capabilities and excellent CD linearity behaviors. The highly transparent backbone polymer enabled to achieve very low sizing doses and near-vertical sidewall profiles over a considerably wide process window. The aspect ratio of the lines increased linearly with thickness, reaching over 4.2 in the 85 micron film.From additional dense plasma etch and strip tests, we conclude that the Arch Durimide TM polyimides compare very advantageously to thick novolak systems to meet the robust process and high throughput requirements of future large-volume MEMS and micromachining applications, especially in the ultra-thick film regime.

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Section: Comparison With a 15µm Thick Dnq / Novolak Resist Processmentioning

confidence: 99%

“…between a few microns and a few hundred microns thick has considerably grown over the last decade [1][2][3][4][5][6][7][8][9]. Micromachining and Micro-ElectroMechanical Systems (MEMS) have experienced most of this growth.…”

Section: Introductionmentioning

confidence: 99%

Process conditions and lithographic performance of arch durimide polyimides in the ultra-thick film regime

Misat¹,

Pellens

Voets

et al. 2003

SPIE Proceedings

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Evaluation of PAC performance in a thick film photoresist

1999

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In this paper we evaluate the photoactive compound (PAC) performance in a thick film photoresist. In an effort to report the performance of a thick film photoresist and the correlation to PAC structure, we have studied several formulations containing a monofunctional PAC(A) in comparison to a polyfunctional PAC(B). We have seen that the use of a monoftmctional photoactive compound provides for a high performance thick film photoresist with good profile, depth of focus, resolution, and exposure latitude. A polyfunctional PAC however, causes a loss in performance. The ratio of monofunctional PAC(A) to polyfunctional PAC(B) was varied and lithography was studied on a Nikon® stepper (i-line). In our study, we evaluate the effect ofthe addition of PAC(B) to our formulations and the consequences in terms oflithographic performance.

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Develop temperature and process study on a thick film photoresist

Lehar

Jensen

1999

SPIE Proceedings

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Development of two new thick-film photoresists

Cited by 5 publications

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Process conditions and lithographic performance of arch durimide polyimides in the ultra-thick film regime

Process conditions and lithographic performance of arch durimide polyimides in the ultra-thick film regime

Evaluation of PAC performance in a thick film photoresist

Develop temperature and process study on a thick film photoresist

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