“…For preparation of films, many techniques have been used including vapor cooling condensation method [18], magnetron sputtering [3,13], chemical bath deposition [19], metal organic chemical vapour deposition (MOCVD) [20], spray pyrolysis [21], plasma-assisted molecular beam epitaxy (PA-MBE) [22,23], reactive electron beam (ebeam) evaporation system [24], dielectric barrier discharged pulsed laser deposition (DBD-PLD) [25], filtered vacuum (cathodic) arc deposition (FVAD, FCVD) [26,27], spin coating method [14], sputtering [15] etc. Pulsed filtered cathodic vacuum arc deposition (PFCVAD) is a common technique to prepare oxide and removal of macroparticles in arc evaporation.…”