2015
DOI: 10.1016/j.microrel.2015.02.015
|View full text |Cite
|
Sign up to set email alerts
|

Diamond layout style impact on SOI MOSFET in high temperature environment

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
11
0

Year Published

2015
2015
2023
2023

Publication Types

Select...
5
2

Relationship

1
6

Authors

Journals

citations
Cited by 24 publications
(11 citation statements)
references
References 10 publications
0
11
0
Order By: Relevance
“…This study focuses on and describes the experimental results of devices defined in #1 and #4 on Table I [5][6][7]. Other devices presented similar tendencies.…”
Section: Resultsmentioning
confidence: 97%
See 2 more Smart Citations
“…This study focuses on and describes the experimental results of devices defined in #1 and #4 on Table I [5][6][7]. Other devices presented similar tendencies.…”
Section: Resultsmentioning
confidence: 97%
“…Regarding the planar CMOS ICs technology, some innovative layouts styles, based on the drain/source-channel interfaces engineering, were proposed to investigate the impact of the gate geometric shape on the electrical performance of MOSFETs, for instance, the Diamond (DM) [5][6][7], Octo (OM) [8], Fish (FM) [9], Wave (WM) [10], and Overlapping-Circular Gate MOSFETs [11]. The ellipsoidal gate shape is another attempt to try to boost the MOSFETs electrical performance, since the resultant longitudinal electric field (LEF) is always composed of three LEF components along the central channel region (longitudinal corner effect, LCE), contrary to the Diamond (two LEF components) [5] and Octo MOSFETs (three LEF components, not totally inside the central gate region) [8].…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…The experimental results of ION/IOFF ratios of the OSM are influenced by its higher ION values compared to their RSM counterparts (Section III.A) and, mainly, by the reduction of IOFF with the increase of the temperature in comparison to the IOFF values presented by their RSM counterparts, as explained in Section III.B. This is another important difference of the octagonal layout style for implementing SOI MOSFET technology in relation to the hexagonal gate geometry [14,30], because for all temperatures considered, the OSM ION/IOFF ratios are always higher to the ones found in their respective RSM counterparts.…”
Section: Ion/ioff Ratiomentioning
confidence: 99%
“…Four prior experimental studies describe in detail the better electrical performance of the DSM [14,30] and OSM [31,32], mainly regarding analog CMOS ICs applications operating at high-temperature environment, in relation to the traditional rectangular MOSFET counterpart.…”
Section: Introductionmentioning
confidence: 99%