Dielectric constant characterization using a numerical method for the microstrip ring resonator

Fang, Xiangyi; Linton, D.; Walker, Chris; Collins, Brian

doi:10.1002/mop.20031

Cited by 15 publications

(5 citation statements)

References 1 publication

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“…HFE-7100 has a loss tangent that is approximately an order of magnitude higher. The empirical fitting performed in this Letter can be automated using a numerical approach similar to the Letter presented by Fang et al [8], which couples HFSS and MATLAB to establish the permittivity of a substrate in air. This method can be extended to find the complex permittivity of a dielectric fluid using the technique presented in this Letter and equations provided by Zou et al [9] to capture loss.…”

Section: Results and Conclusionmentioning

confidence: 99%

Broadband characterisation of engineered dielectric fluids using microstrip ring resonator technique

et al. 2014

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Characterisation results of the complex permittivity of select dielectric cooling fluids at room temperature and over a broad frequency range found using a low-loss printed circuit board microstrip ring resonator technique are presented. ANSYS HFSS, a finite-element full-wave electromagnetic simulation environment, was used to fit the simulated insertion loss to the calibrated measurements of the microstrip ring resonator in air and submerged in different dielectric fluids. The resulting frequency-dependent relative permittivity and loss tangent are provided up to 50 GHz for three dielectric cooling fluids: 3M™ Novec™ 649, 3M™ Novec™ HFE-7100 and 3M™ Fluorinert™ FC-72.

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Section: Results and Conclusionmentioning

confidence: 99%

Broadband characterisation of engineered dielectric fluids using microstrip ring resonator technique

et al. 2014

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“…It is essential to accurately test the permittivity and loss tangent of low-loss dielectric materials to meet the application requirements of various fields. Generally, the permittivity and loss tangent of low-loss dielectric materials are mainly measured by the resonant cavity method, including microstrip resonant cavities [ 12 , 13 , 14 ], rectangular resonant cavities [ 15 , 16 , 17 , 18 ], cylindrical resonant cavities [ 19 , 20 , 21 ], and re-entrant cavity resonators [ 22 ]. For example, Federico Gabriele et al [ 23 ] provided relative permittivity measurements for emerging 5G and beyond applications operating at high frequencies based on resonant cavities with the substrate-integrated waveguide technique.…”

Section: Introductionmentioning

confidence: 99%

A Novel Strategy for Detecting Permittivity and Loss Tangent of Low-Loss Materials Based on Cylindrical Resonant Cavity

Zhou

Chen

et al. 2023

Sensors

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Accurate measurement of the permittivity and loss tangent of low-loss materials is essential due to their special applications in the field of ultra large scale integrated circuits and microwave devices. In this study, we developed a novel strategy that can accurately detect the permittivity and loss tangent of low-loss materials based on a cylindrical resonant cavity supporting the TE111 mode in X band (8–12 GHz). Based on an electromagnetic field simulation calculation of the cylindrical resonator, permittivity is precisely retrieved by exploring and analyzing the perturbation of the coupling hole and sample size on the cutoff wavenumber. A more precise approach to measuring the loss tangent of samples with various thicknesses has been proposed. The test results of the standard samples verify that this method can accurately measure the dielectric properties of samples that have smaller sizes than the high Q cylindrical cavity method.

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“…Many techniques are available to characterize the material properties using transmission-line based methods, such as the short-pulse propagation technique based on time-domain reflectometry measurements [1], microstrip bandpass filters [2], or microstrip gap or ring resonators [3], [4], [5]. A survey of commonly used techniques for characterization of PCB dielectrics is provided in [6].…”

Section: Introductionmentioning

confidence: 99%

Automated Complex Permittivity Characterization of Ceramic Substrates Considering Surface-Roughness Loss

Engin

Pasunoori

2012

Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)

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This paper presents a new method to extract the frequency-dependent dielectric constant and loss tangent of ceramic substrates from high frequency measurements of cavity resonators. A cavity resonator can simply be realized using two ground planes connected with vias to form the side walls. Recently, a rapid plane solver has been developed to efficiently and accurately simulate cavity resonators and extract materials properties by manually fitting simulations to measurements. In this paper, we will demonstrate how the fitting process can be automated. In order to extract the dielectric constant and loss tangent, many simulations need to be run to find the parameters that provide the best match with the measurements. This is a computationally expensive approach. We will present a new method based on tracking sensitivity, which provides a parameterized macromodel for the resonators. Using this approach, the simulation data can be expressed as a low-order rational function of the complex permittivity. Hence, varying the complex permittivity to find the best fit can be done in negligible time after the macromodel has been generated. This new method will be applied to extract the dielectric constant and loss tangent of a ceramic substrate.

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Dielectric constant characterization using a numerical method for the microstrip ring resonator

Abstract: ABSTRACT:A new method of dielectric-constant measurement is developed

Cited by 15 publications

References 1 publication

Broadband characterisation of engineered dielectric fluids using microstrip ring resonator technique

Broadband characterisation of engineered dielectric fluids using microstrip ring resonator technique

A Novel Strategy for Detecting Permittivity and Loss Tangent of Low-Loss Materials Based on Cylindrical Resonant Cavity

Automated Complex Permittivity Characterization of Ceramic Substrates Considering Surface-Roughness Loss

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