Appropriate gate dielectrics must
be identified to fabricate
metal–insulator–semiconductor
field-effect transistors (MISFETs); however, this has been challenging
for compound semiconductors owing to the absence of high-quality native
oxides. This study uses the liquid-gallium squeezing technique to
fabricate 2D amorphous gallium oxide (GaOX) with a high
dielectric constant, where its thickness is precisely controlled at
the atomic scale (monolayer, ∼4.5 nm; bilayer, ∼8.5
nm). Beta-phase gallium oxide (β-Ga2O3) with an ultrawide energy bandgap (4.5–4.9 eV) has emerged
as a next-generation power semiconductor material and is presented
here as the channel material. The 2D amorphous GaOX dielectric
is combined with a β-Ga2O3 conducting
nanolayer, and the resulting β-Ga2O3 MISFET
is stable up to 250 °C. The 2D amorphous GaOX is oxygen-deficient,
and a high-quality interface with excellent uniformity and scalability
forms between the 2D amorphous GaOX and β-Ga2O3. The fabricated MISFET exhibits a wide gate-voltage
swing of approximately +5 V, a high current on/off ratio, moderate
field-effect carrier mobility, and a decent three-terminal breakdown
voltage (∼138 V). The carrier transport of the Ni/GaOX/β-Ga2O3 metal–insulator–semiconductor
(MIS) structure displays a combination of Schottky emission and Fowler–Nordheim
(F–N) tunneling in the high-gate-bias region at 25 °C,
whereas at elevated temperatures it shows Schottky emission and F–N
tunneling in the low- and high-gate-bias regions, respectively. This
study demonstrates that a 2D GaOX gate dielectric layer
can be produced and incorporated into an active channel layer to form
an MIS structure at room temperature (∼25 °C), which enables
the facile fabrication of MISFET devices.