A novel solution-processed amorphous high-k dielectric for thin film transistors (TFTs) has been systemically studied with the objective of achieving high performance and reducing costs for the next generation displays. In this research, the amorphous hafnium silicon multiple oxide (HfSiOx) was fabricated by the simple spin-coating method. Here, we have demonstrated that the incorporation of a silicon oxide has significant effects on the properties of HfO2. The HfSiOx dielectrics have no obvious crystallization peaks even the annealing temperature reach up to 800 o C while the HfO2 films were crystallized at 400 o C. The HfSiOx films have an energy band gap of 6.05 eV, which was wider than HfO2 films (5.69 eV), the breakdown voltage was increased from 2.4 MV/cm (HfO2) to 2.9 MV/cm (HfSiOx) and the leakage current was decreased from 4.4×10 -7 A/cm 2 to 3.7×10 -7 A/cm 2 at an electric field of 2 MV/cm. To achieve optimized device performance, the influence of annealing temperature on the characteristics (including the surface and interface, the chemical and structural evolution) of the solution processed HfSiOx dielectrics was emphasized in this research. To demonstrate the HfSiOx application on oxide TFTs, we fabricated HfInZnO (HIZO) and ZnSnO (ZTO) TFTs with HfSiOx dielectrics, and both of them showed low off-state current indicating the HfSiOx is an attractive candidate used in TFTs. The ZTO TFTs with amorphous HfSiOx dielectrics were operated well under a gate voltage of -0.53 V, exhibiting a high saturation mobility of 153 cm 2 /V·s, a small subthreshold swing of 0.17 V/dec, a large on-off current ratio 3.4×10 7 .