Diffusion Coefficient of Tin(II) Methanesulfonate in Ionic Liquid and Methane Sulfonic Acid (MSA) Solvent

Abstract

for the electrodeposition of tin from Tin(II) methane sulfonate mixed with ionic liquid and methane sulfonate acid at room temperature was studied. Cyclic voltammetry shows redox waves of Tin(II), which proves that the electrodeposition of tin from Tin(II) methane sulfonate is a diffusion-controlled process. The diffusion coefficient of Tin(II) ions in the solvent mixture showed good agreement from both voltammetry and chronoamperometry results. The diffusion coefficient of Tin(II) in the mixture was much smaller than in aqueous solution, and it depends on the anion of the ionic liquid.

Electrodeposition of Sn and Sn Composites with Carbon Materials Using Choline Chloride-Based Ionic Liquids

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Influence of S-dodecylmercaptobenzimidazole as organic additive on electrodeposition of tin

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Indium electrodeposition from indium(iii) methanesulfonate in DMSO

“…[21][22][23] Furthermore, tin(II) methanesulfonate has been synthesized and used as precursor for tin electroplating from a bath composed of MSA and the ionic liquid 1-butyl-1-methyl-pyrrolidinium trifluoromethanesulfonate ([BMP][OTf]). 24 The prepared indium(III) methane-sulfonate was dissolved in DMSO. This solvent exhibits considerable electrochemical stability and has a boiling point of 189 1C, enabling the electrodeposition of indium above its melting point.…”