Direct gold bonding for flexible integrated electronics

Takakuwa, Masahito; Fukuda, Kenjiro; Yokota, Tomoyuki; Inoue, Daishi; Hashizume, Daisuke; Umezu, Shinjiro; Someya, Takao

doi:10.1126/sciadv.abl6228

Cited by 37 publications

(23 citation statements)

References 31 publications

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“…The interconnection microchannel showed excellent stability as the resistance change was only 0.24 Ω when stretched by 100%. Besides, Takakuwa et al [39] have invented the water vapor plasmaassisted bonding (WVPAB) method without the requirement for the additional adhesion layer, resulting in an overall thickness of only 4 μm, as shown in Figure 1(j). Without the adhesion layer, the films bonded by WVPAB method maintained maximum flexibility, and the bending radius could be as low as 0.5 mm, which was superior to the films bonded by the anisotropic conductive film adhesive (ACF) tape, as displayed in Figure 1(j).…”

Section: Flexible and Stretchable Interconnectsmentioning

confidence: 99%

Flexible hybrid electronics: Enabling integration techniques and applications

Huang

Yin

2022

Sci. China Technol. Sci.

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The conventional electronic systems enabled by rigid electronic are prone to malfunction under deformation, greatly limiting their application prospects. As an emerging platform for applications in healthcare monitoring and human-machine interface (HMI), flexible electronics have attracted growing attention due to its remarkable advantages, such as stretchability, flexibility, conformability, and wearing comfort. However, to realize the overall electronic systems, rigid components are also required for functions such as signal acquisition and transmission. Therefore, flexible hybrid electronics (FHE), which simultaneously possesses the desirable flexibility and enables the integration of rigid components for functionality, has been emerging as a promising strategy. This paper reviews the enabling integration techniques for FHE, including technologies for two-dimensional/ three-dimensional (2D/3D) interconnects, bonding of rigid integrated circuit (IC) chips to soft substrate, stress-isolation structures, and representative applications of FHE. In addition, future challenges and opportunities involved in FHE-based systems are also discussed.

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Section: Flexible and Stretchable Interconnectsmentioning

confidence: 99%

Flexible hybrid electronics: Enabling integration techniques and applications

Huang

Yin

2022

Sci. China Technol. Sci.

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“…5 An alternative approach involves making physical electrical connections between stretchable and non-stretchable (e.g., flexible or rigid) substrates. 15 In addition to providing a conventional source of power (e.g., from batteries), these types of connections are also important for transmitting information and electrical signals. Although it is a challenge to create a robust electrical connection between mechanically disparate components, the ability to do so may enable new types of hybrid devices in which at least a portion is stretchable.…”

Section: Introductionmentioning

confidence: 99%

“…An alternative approach involves making physical electrical connections between stretchable and non-stretchable (e.g., flexible or rigid) substrates . In addition to providing a conventional source of power (e.g., from batteries), these types of connections are also important for transmitting information and electrical signals.…”

Section: Introductionmentioning

confidence: 99%

Flexible-to-Stretchable Mechanical and Electrical Interconnects

Erlenbach

Mondal

et al. 2023

ACS Appl. Mater. Interfaces

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Stretchable electronic devices that maintain electrical function when subjected to stress or strain are useful for enabling new applications for electronics, such as wearable devices, human−machine interfaces, and components for soft robotics. Powering and communicating with these devices is a challenge. NFC (near-field communication) coils solve this challenge but only work efficiently when they are in close proximity to the device. Alternatively, electrical signals and power can arrive via physical connections between the stretchable device and an external source, such as a battery. The ability to create a robust physical and electrical connection between mechanically disparate components may enable new types of hybrid devices in which at least a portion is stretchable or deformable, such as hinges. This paper presents a simple method to make mechanical and electrical connections between elastomeric conductors and flexible (or rigid) conductors. The adhesion at the interface between these disparate materials arises from surface chemistry that forms strong covalent bonds. The utilization of liquid metals as the conductor provides stretchable interconnects between stretchable and non-stretchable electrical traces. The liquid metal can be printed or injected into vias to create interconnects. We characterized the mechanical and electrical properties of these hybrid devices to demonstrate the concept and identify geometric design criteria to maximize mechanical strength. The work here provides a simple and general strategy for creating mechanical and electrical connections that may find use in a variety of stretchable and soft electronic devices.

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“…[ 11–13 ] In aerospace engineering, conformal antenna arrays and sensors attached to the irregular surface of an aircraft can effectively reduce the space required for antenna installation, weight of the aircraft, air resistance, and radar scattering area. [ 14–16 ] Nonconformal optical elements with curved structures are essential components of nonconformal optical systems, [ 17–19 ] such as, curved surface imagers. [ 2,4,20–22 ] For example, inspired by the eyes of aquatic animals, Kim et al.…”

Section: Introductionmentioning

confidence: 99%

Curved Photodetectors Based on Perovskite Microwire Arrays via In Situ Conformal Nanoimprinting

Xia

Sun

et al. 2022

Adv Funct Materials

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Micro/nano optoelectronic devices based on curved substrates play a significant role in the development of wearable devices, electronic skin, conformal sensors, conformal antennas, and soft robots. However, the current fabrication processes are oriented toward planar micro/nano devices, and the fabrication of such devices on curved substrates is challenging. Herein, a temperature‐gradient‐assisted nanoimprint‐based in situ micro/nano‐crystal growth method is proposed to fabricate high‐quality curved perovskite microwire crystal (MWC) arrays on curved surfaces. Based on this curved perovskite MWC array without bending‐induced defects, high‐performance curved photodetectors (responsivity = 414 A W−1, detectivity = 1.2 × 1014 Jones, and external quantum efficiency over 140 000%) with extraordinary stability (85% of original performance maintained for more than 2 years) are fabricated to realize a curved imaging device. These results provide insights into the application of high‐performance perovskite photodetectors in nonconformal optical systems.

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Direct gold bonding for flexible integrated electronics

Abstract: Water vapor plasma treatment enables direct gold bonding on flexible polymer films in air at ambient temperatures.

Cited by 37 publications

References 31 publications

Flexible hybrid electronics: Enabling integration techniques and applications

Flexible hybrid electronics: Enabling integration techniques and applications

Flexible-to-Stretchable Mechanical and Electrical Interconnects

Curved Photodetectors Based on Perovskite Microwire Arrays via In Situ Conformal Nanoimprinting

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