2012
DOI: 10.1016/j.jhazmat.2012.09.053
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Disassembly and physical separation of electric/electronic components layered in printed circuit boards (PCB)

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Cited by 74 publications
(49 citation statements)
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“…Recovery, dismantling, and recycling are considered among the most effective approaches to waste printed circuit boards (WPCBs) management, but large-scale implementation has been challenging because of projected low cost-to-benefit ratio of processing mixed e-waste components (Chen et al, 2013). Improved understanding of the chemical compositions of WPCBs has aided recyclers (Dervišević et al, 2013;Lee et al, 2012;Richter et al, 1997;Yin et al, 2011). For example, Yamane et al (Luciana Harue et al, 2011) found that WPCBs from mobile phones (MPs) are composed of 63 wt.% metals; 24 wt.% ceramics and 13 wt.% polymers, while WPCBs from personal computers (PCs) are composed of 45 wt.% metals; 27 wt.% polymers and 28 wt.% ceramics.…”
Section: Introductionmentioning
confidence: 99%
“…Recovery, dismantling, and recycling are considered among the most effective approaches to waste printed circuit boards (WPCBs) management, but large-scale implementation has been challenging because of projected low cost-to-benefit ratio of processing mixed e-waste components (Chen et al, 2013). Improved understanding of the chemical compositions of WPCBs has aided recyclers (Dervišević et al, 2013;Lee et al, 2012;Richter et al, 1997;Yin et al, 2011). For example, Yamane et al (Luciana Harue et al, 2011) found that WPCBs from mobile phones (MPs) are composed of 63 wt.% metals; 24 wt.% ceramics and 13 wt.% polymers, while WPCBs from personal computers (PCs) are composed of 45 wt.% metals; 27 wt.% polymers and 28 wt.% ceramics.…”
Section: Introductionmentioning
confidence: 99%
“…Therefore, the EEC containing precious metals could be selectively treated by suitable hydrometallurgical methods; and therefore, it is expected to make the recycling processes more ef cient and simpler 12) . Studies on the dismantling have attempted to remove the solder, which joins EECs on bare board, by thermal [18][19][20] or mechanical processes 21) . Various heating sources have been employed to melt the solder components such as industrial waste heat 18) and infrared heating 19,20) .…”
Section: Introductionmentioning
confidence: 99%
“…Lee at al. 21) have shown PCB dismantling with automatic mechanical dismantling apparatus by employing diamond grinders. Because these thermal and mechanical separation processes have disadvantages such as consumption of high energy and loss of solder components, respectively, chemical dissolution processes have been investigated as an alternative method using a water-soluble ionic liquid 22) , methanesulfonic acid with hydrogen peroxide 23) , and uorob- oric acid with hydrogen peroxide 24) .…”
Section: Introductionmentioning
confidence: 99%
“…There are many papers reporting on the recovery of high content metals (Cu, Al, Sn) or precious metals (Au, Ag) from WPCBs using physical, chemical, or biological methods, or a combination of these approaches [1][2][3][4][5][6][7][8][9][10][11][12]. However, these processes are very difficult to perform and are expensive not only for the concentration of minor metals but also for their individual recovery.…”
Section: Introductionmentioning
confidence: 99%
“…For these reasons, few studies have focused on the recovery of metals that have low concentrations of electric/electronic components (EECs) due to the diversity of mounted EECs in WPCBs, such as in varistors, condensers, inductors, resistors, diodes, and so on. These EECs consist of various metals, such as zinc, copper, cobalt, and nickel, as well as toxic substances [12]. Among these EECs, metal oxide varistors (MOVs) are widely used in electronic devices.…”
Section: Introductionmentioning
confidence: 99%