2008
DOI: 10.1063/1.2990644
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Dislocation density reduction in multicrystalline silicon solar cell material by high temperature annealing

Abstract: We propose and demonstrate a method to remove performance-limiting dislocations from multicrystalline silicon (mc-Si) solar cell material, appropriate for wafers or bricks. Dislocation density reductions of >95% are achieved in commercial mc-Si via high temperature annealing with an impurity diffusion barrier, with controlled ambient and time-temperature profiles. The dislocation density reduction follows temperature-dependent models developed by Kuhlmann [Proc. Phys. Soc., London, Sect. A 64, 140 (1951… Show more

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Cited by 73 publications
(47 citation statements)
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“…When the annealing temperature was about 1360°C, few etch-pits apart from the grain boundaries could be observed clearly. The results show that when the annealing temperature varies from 1100 to 1400°C,the dislocation density in the bulk UMG multi-Si decreases as the annealing temperature increases, which is consistent with the experimental results of Hartman et al [7]. It has been reported that metal precipitates at grain boundaries and dislocations can gradually dissolve and diffuse into the neighboring regions above 1000°C [9].…”
Section: Influence On Dislocation Densitysupporting
confidence: 81%
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“…When the annealing temperature was about 1360°C, few etch-pits apart from the grain boundaries could be observed clearly. The results show that when the annealing temperature varies from 1100 to 1400°C,the dislocation density in the bulk UMG multi-Si decreases as the annealing temperature increases, which is consistent with the experimental results of Hartman et al [7]. It has been reported that metal precipitates at grain boundaries and dislocations can gradually dissolve and diffuse into the neighboring regions above 1000°C [9].…”
Section: Influence On Dislocation Densitysupporting
confidence: 81%
“…This finding is in conflict with the results of Hartman et al who reported that dislocation density had a decisive influence on the minority carrier lifetime of Si materials, especially multi-Si materials [7]. As well as the dislocation and grain boundary densities, the structure, chemical state and spatial distribu-tion of the metal impurities in the wafers have a significant or even decisive influence on the electrical properties of the UMG-Si materials, especially multi-Si materials with a high concentration of impurities.…”
Section: Influence On Electrical Propertiescontrasting
confidence: 56%
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“…Their behaviour is of fundamental importance for the performance of thermoelectric devices 2 , nano-electronics 3,4 and solar cells 5,6 . In structural engineering alloys, used for high-performance aerospace applications, dislocation-mediated slip is one of the main deformation mechanisms 7 .…”
mentioning
confidence: 99%
“…During heating, we assume a negligible precipitate dissolution energy barrier in all models-precipitates can start to dissolve the instant the solid solubility exceeds [Fe,] [26,48]. Lastly, we assume that structural defects are stationary and neither generated nor annihilated by processing, as the used temperature ranges are not high enough to allow significant dislocation movement [49][50][51].…”
Section: Systematic Variation Of Model Elementsmentioning
confidence: 99%