Distributed RLGC transient model of coupled interconnects in DSM chips for crosstalk noise simulation

Abstract

Noise effects in coupled interconnects, Le. crosstalk induced glitch and crosstalk induced delay can significantly impact the performance of deep sub-micron (DSM) chips. Therefore, in this paper distributed RLGC transient model of coupled interconnects has been developed that will be useful for analyzing such crosstalk noise effects in DSM chips. The model accuracy is quite comparable to the PSPICE simulation results and yet the simulation speed is at least 11 times faster than the latter.

Decoupled victim model for the analysis of crosstalk noise between on-chip coupled interconnects

“…Comparing (16) with the ABCD model of a single interconnect provided in [3], it can concluded that decoupled per-unit-length resistance, inductance, conductance and capacitance for the equivalent victim model can be represented as: …”

“…Therefore, it is important to track down the limiting values/critical values of all such influencing (coupling) parasitic, below which a fault tolerant behavior of the device can be guaranteed. A comprehensive distributed crosstalk fault model similar to [3], which considers distributed RLGC parameters of two or more coupled interconnects, coupling parameters together with the strengths of the CMOS drivers and the receivers, is generally used for such simulation experiments. Though the model considered in [3] is very accurate but it requires simultaneous analysis of both victim and aggressor interconnects.…”

“…A comprehensive distributed crosstalk fault model similar to [3], which considers distributed RLGC parameters of two or more coupled interconnects, coupling parameters together with the strengths of the CMOS drivers and the receivers, is generally used for such simulation experiments. Though the model considered in [3] is very accurate but it requires simultaneous analysis of both victim and aggressor interconnects. An easier or, a very convenient way is to decouple the circuit and analyze the victim wire for all such noise effects.…”

“…Namely, if t r /t d < 2.5, lumped analysis is not at all appropriate and transmission lines model or distributed RLGC type model should be used [5]. Recently an RLGC transient model of coupled interconnects was proposed by [3] which considers all coupling effects namely, mutual capacitance, mutual inductance and even mutual (leakage) conductance (if any) between two adjacent interconnects. The reason for the consideration of both inductive and capacitive couplings is that line inductance and/or mutual inductance in certain interconnect lines usually give rise to overshoots and undershoots in voltage waveforms, which may cause reliability problems in circuits, cause also glitches and may lead to false transitions at the gate output.…”

Crosstalk Simulation Based on Full Wave S-Parameter Extraction Method between High-Speed Signals

“…Crosstalk between transmission lines is one of most important SI issues and can not be neglected. The classic crosstalk theory based RLGC model which is acquired by estimating parasitic parameters( , , , R L G C ), assumes that electrical field coupling(capacitive coupling) and magnetic field coupling(inductive coupling) mainly contribute to the crosstalk issues [1], [2]. The RLGC model is simple and easy to use, however, there are shortcomings caused by the model itself.…”