Distribution of residual strain around nanoindentations in silicon

Li, X.; Zhong, Li; Tao, Xingfu; Ren, Lingling; Gao, Sitian; Xu, Gaohong

doi:10.1016/j.matlet.2014.06.004

Cited by 9 publications

(10 citation statements)

References 21 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The tangled structure not only inhibits the subsequent motion of dislocation on identical slip plane but also leads to machined surface work-hardening. Corresponding to this, as demonstrated in Cheng’s experiments [ 39 ], the plastic deformation can be generated in monocrystalline silicon by a laser shock peening experiments, which showed that shock pressure could lead to the tangled structure among dislocations and improve the ability of anti-deform in Figure 12 b. Furthermore, in order to reveal the failure essence of brittle material, the RC model has been divided into the PSBs zone and free-dislocations zone in Figure 13 a.…”

Section: Resultssupporting

confidence: 56%

“…In particular, due to the low self-diffusion of monocrystalline silicon, restricted dislocation cannot bypass the dislocation obstacles and impurity particles by climbing [ 38 ]. Therefore, most movable objects are obstructed at the end of loading stages, as shown in Figure 8 d. It is worth noting that the dislocation configurations are consistent with the microstructure arrangement of monocrystalline silicon after warm laser shock peening [ 39 ].…”

Section: Resultsmentioning

confidence: 76%

“… ( a ) The evolution of yield strength during transient irregular cutting process; ( b ) the TEM images obtained from transient loaded silicon crystal [ 39 ]. …”

Section: Figurementioning

confidence: 99%

See 2 more Smart Citations

Multiscale Analyses of Surface Failure Mechanism of Single-Crystal Silicon during Micro-Milling Process

Bai

Tong

2017

Materials

View full text Add to dashboard Cite

This article presents an experimental investigation on ductile-mode micro-milling of monocrystalline silicon using polycrystalline diamond (PCD) end mills. Experimental results indicate that the irregular fluctuation of cutting force always induces machined surface failure, even in ductile mode. The internal mechanism has not been investigated so far. The multiscale discrete dislocation plasticity framework was used to predict the dislocation structure and strain evolution under the discontinuous cutting process. The results showed that a mass of dislocations can be generated and affected in silicon crystal. The dislocation density, multiplication rate, and microstructure strongly depend on the milling conditions. In particular, transient impulse load can provide a great potential for material strength by forming dislocations entanglement structure. The continuous irregular cutting process can induce persistent slip bands (PSBs) in substrate surface, which would result in stress concentration and inhomogeneous deformation within grains.

show abstract

Section: Resultssupporting

confidence: 56%

Section: Resultsmentioning

confidence: 76%

See 1 more Smart Citation

Multiscale Analyses of Surface Failure Mechanism of Single-Crystal Silicon during Micro-Milling Process

Bai

Tong

2017

Materials

View full text Add to dashboard Cite

show abstract

“…Recently, electron backscattered diffraction (EBSD) has become an increasingly important non-destructive technique for measuring the residual strain on the surface of crystalline materials with high spatial resolution (<50 nm) [15,16]. Using cross-correlation analysis of the EBSD pattern, strain sensitivity on the level of about 10 −4 has already been obtained [17].…”

Section: Introductionmentioning

confidence: 99%

Non-destructive evaluation of the strain distribution in selected-area He+ ion irradiated 4H-SiC

Yang

Tokunaga

Kondo

et al. 2020

Applied Surface Science

View full text Add to dashboard Cite

“…Moreover, the crystal orientation has a significant influence on the mechanical properties of anisotropic materials. Investigating the mechanical anisotropy of materials is of great significance for improving the processing parameters of a material, and obtaining good surface quality and better design tools [20][21][22].…”

Section: Introductionmentioning

confidence: 99%

Effects of Crystal Orientation on the Crack Propagation of Sapphire by Sequential Indentation Testing

Wang

Jiang

et al. 2017

Crystals

View full text Add to dashboard Cite

Single-crystal sapphire (α-Al 2 O 3) is a hard and brittle material. Due to its highly crystalline nature, the fracture behavior of sapphire is strongly related to its crystal structure, and understanding the effects of crystal structure on the crack propagation of sapphire is essential for the successful application of this important material (e.g., as wafers in the electronics industry). In the present work, crack propagation that is induced by sequential indentation was investigated on the A-plane and C-plane of sapphire using a Vickers indenter on a micrometer scale. It was found that increasing indentation depth obviously increases the rate of crack propagation on the A-plane, but this effect is not so obvious on the C-plane because of the different slip systems induced by indentation on the different crystal planes of sapphire. Moreover, some parallel linear traces along the A-plane, which fracture with increasing indentation depth, are observed from the residual indentation on the A-plane. The fracture toughness of both A-plane and C-plane sapphire is smaller after indentation testing than that obtained using conventional testing methods. The subsurface damage was detected by transmission electron microscopy (TEM).

show abstract

Distribution of residual strain around nanoindentations in silicon

Cited by 9 publications

References 21 publications

Multiscale Analyses of Surface Failure Mechanism of Single-Crystal Silicon during Micro-Milling Process

Multiscale Analyses of Surface Failure Mechanism of Single-Crystal Silicon during Micro-Milling Process

Non-destructive evaluation of the strain distribution in selected-area He+ ion irradiated 4H-SiC

Effects of Crystal Orientation on the Crack Propagation of Sapphire by Sequential Indentation Testing

Contact Info

Product

Resources

About