2013
DOI: 10.1063/1.4818714
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Doping-free silicon thin film solar cells using a vanadium pentoxide window layer and a LiF/Al back electrode

Abstract: This work describes the preparation of a doped layer-free hydrogenated amorphous silicon (a-Si:H) thin film solar cell consisting of a vanadium pentoxide (V2O5-x) window layer, an intrinsic a-Si:H absorber layer, and a lithium fluoride (LiF)/aluminum (Al) back electrode. The large difference between the work functions of the V2O5-x layer and the LiF/Al electrode permitted photogenerated carriers in the i-a-Si:H absorber layer to be effectively separated and collected. The effects of the V2O5-x layer thickness … Show more

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Cited by 13 publications
(7 citation statements)
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“…This could be attributed to the low thickness and density of the LiF layer w/o APTES, which might have resulted in a poor thin-lm coverage. 5,9 The addition of APTES with LiF reduced the leakage current and improved the V oc of the devices signicantly, which indicates that the addition of APTES improved the LiF layer density by providing adequate thin-lm coverage and suppressed the charge recombination. Moreover, in terms of device stability enhancement Wang et al 30 presented that the deposition of a thin ($5 nm) APTES SAM could efficiently inhibit the diffusion of metals into adjacent dielectrics and could simultaneously improve the interfacial adhesion.…”
Section: Resultsmentioning
confidence: 96%
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“…This could be attributed to the low thickness and density of the LiF layer w/o APTES, which might have resulted in a poor thin-lm coverage. 5,9 The addition of APTES with LiF reduced the leakage current and improved the V oc of the devices signicantly, which indicates that the addition of APTES improved the LiF layer density by providing adequate thin-lm coverage and suppressed the charge recombination. Moreover, in terms of device stability enhancement Wang et al 30 presented that the deposition of a thin ($5 nm) APTES SAM could efficiently inhibit the diffusion of metals into adjacent dielectrics and could simultaneously improve the interfacial adhesion.…”
Section: Resultsmentioning
confidence: 96%
“…7,8 However, the greatest challenge in further development of high performance a-Si:H TFSCs is without (w/o) the involvement of hazardous/toxic doping gases. 5,6,9,10 The fabrication of such devices should be carried out under extremely safe environments. In addition, the use of hazardous/toxic doping gases causes device instabilities because of carrier trapping and the formation of Si dangling bonds.…”
Section: Introductionmentioning
confidence: 99%
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“…Metal oxide thin films are an integral part in modern electronic devices and are important in energy storage 1 2 , supercapacitors 3 4 5 , field emission devices 6 7 , photovoltaics 8 , thermochromics 9 10 11 and as components of the working electrodes in sensing devices 12 13 . Improvements in thin film deposition and characterization techniques are of particular interest for high- and low-κ dielectric materials for micro- and nano-electronic devices, where conformal and stoichiometric coatings are required.…”
mentioning
confidence: 99%
“…Many phases of VO have applications in areas as intercalation materials 36 , energy storage 37 , electrochromic 38 and thermochromic devices 39 . Solution processed amorphous and crystalline V 2 O 5 thin films have recently been demonstrated as hole transport layers in polymer solar cells where uniform defect free surfaces are required 8 40 41 . By adjusting the crystallisation steps of as-deposited VO from solution processed thin films, it is possible to produce different VO phases in thin film form 9 .…”
mentioning
confidence: 99%