Double-sided cooling and thermo-electrical management of power transients for silicon chips on DCB-substrates for converter applications: Design, technology and test

Abstract

This paper deals with the system design, technology and test of a novel concept of integrating Si and SiC power dies along with thermo-electric coolers in order to thermally manage transients occurring during operation. The concept features double-sided cooling as well as new materials and joining technologies to integrate the dies such as transient liquid phase bonding/soldering and sintering. Coupled-field simulations are used to predict thermal performance and are verified by especially designed test stands to very good agreement. This paper is the second in a series of publications on the ongoing work

Enhancement of Commercial Grade VLSI Chips into Industrial Grade using a Novel Thermal Monitoring and Control Technique

“…The use of thermoelectric cooler(TEC) to cool the chip is reported in [7]. The double side cooling of chips to restrict chip temperature within the specific range of positive side is depicted in [8]. The use of TEC for cooling electronics in 3D with heat spreader is shown in [9].…”

“…The use of TEC for cooling electronics in 3D with heat spreader is shown in [9]. In [8,9] heat dissipation at the other side of the TEC is managed with heat sink and heat dissipation mechanism. All mentioned techniques, moreover extending the operating temperature of chip at positive extreme end.…”

Thermal management of electrical overload cases using thermo-electric modules and phase change buffer techniques: Simulation, technology and testing

“…This method has been described in [1,2] and is depicted in figure 5 for the considered thin film TEC. To confirm and also refine the data, including relation to samples as well as joining process degradation, TEC testing with a testing stand of reduced complexity were carried out.…”