This paper deals with the system design, technology and test of a novel concept of integrating Si and SiC power dies along with thermo-electric coolers in order to thermally manage transients occurring during operation. The concept features double-sided cooling as well as new materials and joining technologies to integrate the dies such as transient liquid phase bonding/soldering and sintering. Coupled-field simulations are used to predict thermal performance and are verified by especially designed test stands to very good agreement. This paper is the second in a series of publications on the ongoing work

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In this paper, a cooling concept for power electronics is discussed, using thermo-electric cooling in combination with a phase-change based latent heat storage module. It was designed to cope with thermal transients due to periodic overload operation phases of an IGBT power converter module. Several sub-system simulations and experiments have already been performed in previous publications leading to the current design state, which is now being tested under emulated experimental conditions. Very good results are presented, showing the feasibility of the transient cooling concept. On-going work referred to the long-Term thermal stability and operation as well as a smart electrical TEC control will be motivated

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