We report on the growth and electronic properties of polycrystalline III-V semiconductors, which to date have not been discussed in depth in the literature. III-V polycrystalline semiconductor thin films were grown by metalorganic vapour phase epitaxy in the temperature range 410°C-475°C, which is compatible for integration into the Back-End-Of-Line (BEOL) silicon based integrated circuits. The thickness of the films in this study is in the range of tens to a few hundreds of nanometers, and deposited on amorphous substrates (either smart-phone-grade glass or Si/SiO 2 ) and, also, on oxidised GaAs epi-ready wafers. Extensive AFM, SEM and TEM analyses show interlinked-to-continuous polycrystalline III-V films based on In(Al)As or GaSb. Hall-van der Pauw measurements return results of high mobility and controllable charge density for n-and p-type field effect transistors. In the GaAs/In(Al)As system, electron density ranging from 1×10 16 to 1×10 19 cm −3 (n) was achieved, with room temperature mobility values in the range of 100-150 cm 2 V −1 s −1 and hole mobility values in the range of 1-10 cm 2 V −1 s −1 have been measured in Zn doped samples. Polycrystalline GaSb films demonstrated p-type behaviour (1×10 17 cm −3 ) with remarkably high room temperature hole mobility values up to 66 cm 2 V −1 s −1 for the films grown on Si/SiO 2 substrate (and 300 cm 2 V −1 s −1 for the GaAs substrate where an epitaxial process is actually in place). Materials could be stacked into heterostructures, providing a promising platform for complex devices enabling compatible n-and phetero-layers for 3D integration formed at temperatures 480°C.