1981
DOI: 10.1002/app.1981.070261019
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Dry etching durability of positive electron resists

Abstract: SynopsisThe effects of positive electron resist structures and G values for scission on dry etching durability have been studied with regard to plasma etching, reactive sputter etching, and plasma ashing.Polymers of aromatic methacrylates, especially poly(a-methylstyrene), all of which contain a benzene ring in the side chain, exhibit superior durability for each etching system. On the other hand, polymers of fluorinated and chlorinated methacrylates show low durability compared with the nonsubstituted polymet… Show more

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Cited by 25 publications
(9 citation statements)
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“…The bent point was observed about 20°C below Tg of non-halogenated poly(alkyl methacrylate)s, but the correlation between the bent point and Tg did not hold in the case of poly(aromatic methacrylate)s, halogenated polymethacrylates, poly(methyl isopropenyl ketone), and PMSt. 6 The correlation was not observed for the current copolymer systems, either. Quantum yield for the unimolecular chain scission of solid polymers, which is governed by mobility of polymer segments to form a special transition state (e.g., Norrish Type II reaction), is known to increase above Tg rapidly to the same value as that obtained in solution.…”
Section: ) Temperature Dependence Of Dry Etching Ratementioning
confidence: 71%
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“…The bent point was observed about 20°C below Tg of non-halogenated poly(alkyl methacrylate)s, but the correlation between the bent point and Tg did not hold in the case of poly(aromatic methacrylate)s, halogenated polymethacrylates, poly(methyl isopropenyl ketone), and PMSt. 6 The correlation was not observed for the current copolymer systems, either. Quantum yield for the unimolecular chain scission of solid polymers, which is governed by mobility of polymer segments to form a special transition state (e.g., Norrish Type II reaction), is known to increase above Tg rapidly to the same value as that obtained in solution.…”
Section: ) Temperature Dependence Of Dry Etching Ratementioning
confidence: 71%
“…4 · 16 • 17 The Gs-value is reported to be 1.3 4 2.3. 6 Degradation of PMSt at 25°C under vacuum is explained as a random· breaking of skeletal chain bond accompanied by depropagation to split off about 100 monomer units/ 8 and the determined Gsvalue is 0.23 6 Since the PMSt-MMA copolymers, which were prepared by radical polymerization, contained MSt units isolated from each other in the copolymer chain as was deduced theoretically from the copolymerization reactivity ratio of MSt and confirmed Polymer J., Vol. 17, No.…”
Section: ) Effect Of Copolymerization Ratiomentioning
confidence: 72%
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“…On the other hand, the development of main-chain scission type (positive) EB resists exhibiting dry etching resistance is relatively difficult given that their high tendency towards degradation reduces the dry etching resistance [3]. ZEP520A (ZEON) is a relatively recently developed positive EB resist exhibiting high tendency towards degradation and dry etching resistance.…”
Section: Introductionmentioning
confidence: 99%