Dry micro-grooving on Si wafer using a coarse diamond grinding

Xie, Jianhe; Xie, Hailong; Liu, X.R.; Tan, T.W.

doi:10.1016/j.ijmachtools.2012.05.004

Cited by 30 publications

(7 citation statements)

References 10 publications

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“…Since the average size of #46 diamond grain was about 350 μm, the grain protrusion height can reach 48% of the theoretical grain size after electrical discharge dressing. According to the literature [20], after the traditional mechanical dressing, the grain protrusion height was only about 1/3 of the theoretical grain size. Therefore, compared with the traditional mechanical dressing, the dry electrical discharge dressing technique not only had higher dressing efficiency, but also could achieve a higher grain protrusion, which was conducive to continuous and efficient grinding.…”

Section: Resultsmentioning

confidence: 99%

Efficient and Precise Grinding of Sapphire Glass Based on Dry Electrical Discharge Dressed Coarse Diamond Grinding Wheel

Luo

et al. 2019

Micromachines

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In this paper, in view of low grinding efficiency and poor ground surface quality of sapphire glass, the coarse diamond grinding wheel dressed by dry impulse electrical discharge was proposed to perform efficient and precise grinding machining of sapphire glass. The dry electrical discharge dressing technology was employed to obtain high grain protrusion and sharp micro-grain cutting edges. The influences of grinding process parameters such as wheel speed, depth of cut and feed speed on the ground surface quality, grinding force and grinding force ratio on sapphire glass were investigated, and the relationship between grinding force and ground surface quality was also revealed. The experimental results show that the grain protrusion height on the surface of a coarse diamond grinding wheel dressed by dry electrical discharge can reach 168.5 µm. The minimum line roughness Ra and surface roughness Sa of ground sapphire glass surface were 0.194 µm and 0.736 µm, respectively. In order to achieve highly efficient ground quality of sapphire glass, the depth of cut was controlled within 7 µm, and the wheel speed and feed speed were 3000–5000 r/min and 10–20 mm/min, respectively. The influences of feed speed and wheel speed on grinding force ratio were more significant, but the influence of depth of cut was little.

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Section: Resultsmentioning

confidence: 99%

Efficient and Precise Grinding of Sapphire Glass Based on Dry Electrical Discharge Dressed Coarse Diamond Grinding Wheel

Luo

et al. 2019

Micromachines

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“…It is shown that the surface roughness R a decreased with increasing wheel speed v w both in the case of precision and mirror micro-grindings. The reason is that increasing wheel speed may decrease the grain cutting depth to reach ductile-mode removal [17]. It, however, increased as v w =19.6 m/s.…”

Section: Measurementsmentioning

confidence: 98%

“…The former is because decreasing feed speed may decrease grain cutting depth to approach ductile-mode removal [17]. The latter is because the spark-out grinding may make the grain cutting depth approach nanometer-scale critical cutting depth from brittle-mode removal to ductile-mode removal [4].…”

Section: Micro-grinding Variables Influencing Micro-ground Surface Romentioning

confidence: 99%

“…3c). This is because the micro-meter diamond grains distributed on wheel V-tip were able to perform ductile-mode cutting of brittle material by nanometer depth of cut that may be controlled by grinding variables and grain protrusion parameters [17]. On the XY-section of workpiece ellipsoidal surface at z=z i , the workpiece elliptical profile was tangent to wheel V-tip arc-profile.…”

Section: Introductionmentioning

confidence: 99%

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Precision and mirror micro-grinding of micro-lens array on macro-freeform glass substrate for micro-photovoltaic performances

Zhang

Xie

Guo

et al. 2015

Int J Adv Manuf Technol

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A hybrid of micro-lens array and freeform surface produces a novel micro-optic and micro-photovoltaic behaviors, but it is difficult to control both micro-form and macroform accuracies in micro-machining of brittle photovoltaic glass. Hence, a ductile micro-grinding is proposed to replicate the precision-trued diamond wheel V-tip on macro-freeform glass substrate of solar cell. The objective is to understand the formation mechanism of accurate micro-lens array on freeform glass surface for photovoltaic application. First, the micro-optic properties of freeform micro-lens array were analyzed with regard to micro-and macro-shapes. Second, the precision and mirror micro-grinding along with the form errors of freeform micro-lens array was observed on the base of the transfer from brittle-mode removal to ductile-mode removal. Finally, the photovoltaic properties were experimentally measured. It is shown that the freeform micro-lens array increases luminous flux by 53.8-54.5 % compared with the plane and micro-lens array. The micro-form accuracy and the micro-structure mirror are dominated by micro-meter-scale diamond wheel V-tip with accurate wheel V-tip profile and integrated micro-grains protrusion, respectively. The novel measuring model of freeform micro-lens array may be used to evaluate and control the curved micro-form accuracy. The freeform micro-lens array contributes to the improvement of photovoltaic performance in scattered light illumination.

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“…学制造领域研究热点之一 [1][2][3] 。目前，美国、德国、日本等国家先后使用超精密磨削、超精密切削、微细电火花加工技术、光刻技术、LIGA 技术等超精密加工技术在微结构光学元件或模具上进行超精密加工。其中微结构超精密磨削因其具有效率高、加工精度高、表面粗糙度小并能够加工高硬度材料等优点，成为微结构光学元件或模具加工的主要方法 [4][5] 。然而，在微结构磨削中金刚石砂轮尖端需要采用合理的精密修整，获得高形状精度、小尖端圆弧半径的砂轮尖端，并且要求长时间的砂轮精度保持性。为此，国内外学者开展了一系列的微结构砂轮精密修整理论与技术研究。有学者提出干式电火花技术修整金刚石砂轮 V 形尖端方法用于金属结合剂砂轮修整 [6][7][8] 。华南理工大学谢晋等 [9][10][11] 利用碳化硅(GC)磨石对金刚石砂轮尖端进行数控对磨修整，尖端圆弧半径达到 20 μm。日本 SUZUKI 等 [2] 利用钼、钽铌合金块对磨修整金刚石砂轮 V 形尖端，修整出圆弧半径很小的 V 形尖端。哈尔滨工业大学 GUO 等 [12] 利用 GC 修整轮进行展成磨削法修整金刚石砂轮…”

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Experimental Study on Diamond Wheel V-tip Truing Using a Tangential Grinding Truing Method

Zhi-Qiang¹

2018

JME

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Abstract：In order to improve the machining quality during truing V-tip of diamond grinding wheel, a tangential grinding truing method is presented. A serial of truing experiments are conducted with the resin-bonded and metal-bonded diamond wheels, and micro grinding experiments on cemented carbide micro structure array also are carried out. Experiments results show that the radius of V-tip of resin-bonded and metal-bonded diamond wheel have been trued to 3.5 μm and 2.0 μm, respectively. The V-tip radius of trued wheel is increased as the increase of feed rate and truing depth per pass, and decreased as the increase of the diamond wheel speed and grain size number of silicon carbide (GC) wheel. Metal-bonded diamond wheel has a lower truing efficiency but a smaller radius of V-tip, compared with resin-bonded diamond wheel. Further, experimental results on micro structure array show that the cemented carbide materials are precisely ground by the trued diamond wheels, a better machining quality are obtained by using the resin-bonded wheel, and it is prone to remove the cemented carbide material in ductile mode.

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Dry micro-grooving on Si wafer using a coarse diamond grinding

Cited by 30 publications

References 10 publications

Efficient and Precise Grinding of Sapphire Glass Based on Dry Electrical Discharge Dressed Coarse Diamond Grinding Wheel

Efficient and Precise Grinding of Sapphire Glass Based on Dry Electrical Discharge Dressed Coarse Diamond Grinding Wheel

Precision and mirror micro-grinding of micro-lens array on macro-freeform glass substrate for micro-photovoltaic performances

Experimental Study on Diamond Wheel V-tip Truing Using a Tangential Grinding Truing Method

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