Durable Cu corrosion inhibition in acidic solution by SAMs of Benzenethiol

Caprioli, Fabrizio; Decker, F.; Castro, V. Di

doi:10.1016/j.jelechem.2011.03.034

Cited by 18 publications

(12 citation statements)

References 19 publications

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“…Among them, benzotriazole (BTA; Fig. 1A ) is one of the most commonly used inhibitors, especially for Cu metal in halogen media (Cl − , for example) ( 25 , 27 , 28 ). Motivated by this anticorrosion idea, here, we introduce a BTA layer in inverted PSCs before Cu electrode deposition to avoid electrode corrosion and thus improve device stability ( Fig.…”

Section: Introductionmentioning

confidence: 99%

Chemical anti-corrosion strategy for stable inverted perovskite solar cells

Zhang

et al. 2020

Sci. Adv.

121

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One big challenge for long-lived inverted perovskite solar cells (PSCs) is that commonly used metal electrodes react with perovskite layer, inducing electrode corrosion and device degradation. Motivated by the idea of metal anticorrosion, here, we propose a chemical anticorrosion strategy to fabricate stable inverted PSCs through introducing a typical organic corrosion inhibitor of benzotriazole (BTA) before Cu electrode deposition. BTA molecules chemically coordinate to the Cu electrode and form an insoluble and polymeric film of [BTA-Cu], suppressing the electrochemical corrosion and reaction between perovskite and the Cu electrode. PSCs with BTA/Cu show excellent air stability, retaining 92.8 ± 1.9% of initial efficiency after aging for 2500 hours. In addition, >90% of initial efficiency is retained after 85°C aging for over 1000 hours. PSCs with BTA/Cu also exhibit good operational stability, and 88.6 ± 2.6% of initial efficiency is retained after continuous maximum power point tracking for 1000 hours.

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Section: Introductionmentioning

confidence: 99%

Chemical anti-corrosion strategy for stable inverted perovskite solar cells

Zhang

et al. 2020

Sci. Adv.

121

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“…c). According to the standard Cu 2p core level spectrum, the two additional peaks at binding energies of approximately 942 and 962 eV suggest the appearance of CuO on the sample surface. However, for the H + ion beam‐treated sample, no such additional peaks could be observed (Fig.…”

Section: Resultsmentioning

confidence: 99%

“…To enhance the oxidation resistance of copper substrates, many types of coating such as titanium, tungsten carbide, ceramic, and graphene have been used to protect copper substrates and enhance their anti‐oxidization ability. Much effort has been devoted to the development of new coating materials involving protective polymer coatings to improve the anticorrosion behavior of the copper substrates . The behavior of plasma polymer coatings for Cu corrosion protection has also been investigated in cathodic polymerization and radio frequency (RF) glow discharge polymerization .…”

Section: Introductionmentioning

confidence: 99%

Using a low-energy proton beam to cross-link polymer films for the protection of inorganic substrates

Zheng

Zhao

Wang

et al. 2016

Surf. Interface Anal.

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Oxidation and corrosion effects on virgin copper and silicon substrates under ambient conditions largely restrict their electronic and microelectronic applications in industrial fields. In this paper, we first aimed to fabricate cross‐linked organic thin films on a copper substrate by bombardment with a low‐energy proton beam, thus enhancing the films' anti‐oxidization ability under ambient conditions, as confirmed using X‐ray photoelectron spectroscopy and atomic force microscopy. The anti‐oxidization ability of the cross‐linked polymer films on silicon substrate was also considered. Copyright © 2016 John Wiley & Sons, Ltd.

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“…Thiol materials with a hydrophobic chain can lead to reliable and repeatable adhesion [9]. However, the reported thiol-based selfassembled treatment time ranges from 16 to 24 hours [9,10]. This long preparation time greatly hinders the adoption of thiol-based SAM in the high throughput industrial applications.…”

Section: Introductionmentioning

confidence: 99%

“…In contrast to traditional passive immersion treatment of SAM [9,10], we applied an electric potential on the Cu substrate during assembly process in a standard three-electrode cell. We employed an energy-based Tapered Double Cantilever Beam (TDCB) fracture toughness test in order to evaluate the adhesion characteristics of SAM-modified Cu/epoxy interface.…”

Section: Introductionmentioning

confidence: 99%

Electrochemical assembly and molecular dynamics simulation of SAM on copper for epoxy/copper adhesion improvement

Kwok

Yuen

2013

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)

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This work reports on adhesion enhancement effects of self-assembled organothiol treatment on copper (Cu)/epoxy interface, as well as a significant reduction in treatment time under the influence of electric potential. The interfacial adhesion has 20-fold enhancement through the treatment due to improved linkage between copper substrate and epoxy layer by chemisorbed organothiol molecules. The treatment time was greatly reduced by a factor 32 from 16 hours to 30 minutes thanks to the electrical field assisted method without compromising the maximum adhesion strength, which was shown to be in order of 97.2 Jm -2 . Molecular Dynamics (MD) simulations were also carried out for studying the surface coverage effect of Self-assembly Monolayer (SAM) on Cu surface towards adhesion strength between Cu/epoxy interface. Simulation results together with experimental data were then used for explaining the adhesion promotion mechanism between Cu/epoxy interface.

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Durable Cu corrosion inhibition in acidic solution by SAMs of Benzenethiol

Cited by 18 publications

References 19 publications

Chemical anti-corrosion strategy for stable inverted perovskite solar cells

Chemical anti-corrosion strategy for stable inverted perovskite solar cells

Using a low-energy proton beam to cross-link polymer films for the protection of inorganic substrates

Electrochemical assembly and molecular dynamics simulation of SAM on copper for epoxy/copper adhesion improvement

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