2008
DOI: 10.1117/12.772469
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EBDW technology for EB shuttle at 65nm node and beyond

Abstract: When manufacturing prototype devices or low volume custom logic LSIs, the products are being less profitable because of the skyrocketing mask and design costs recent technology node. For 65nm technology node and beyond, the reduction of mask cost becomes critical issue for logic devices especially. We attempt to apply EBDW mainly to critical interconnect layers to reduce the mask expenditure for the reason of technical output reusability.For 65nm node production, new 300mm EB direct writer had been installed. … Show more

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Cited by 15 publications
(15 citation statements)
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“…Transistor stacking is considered a special type of chaining. Stacks have an advantage over regular chaining in that they do not need a contact and, consequently, might improve the layout density in some process technologies 3 . Therefore, if multiple chaining solutions have the maximum number of abutments, we pick the one with the maximum number of stacks.…”
Section: Variant Of Bipartite Matching W/ Clusteringmentioning
confidence: 99%
See 1 more Smart Citation
“…Transistor stacking is considered a special type of chaining. Stacks have an advantage over regular chaining in that they do not need a contact and, consequently, might improve the layout density in some process technologies 3 . Therefore, if multiple chaining solutions have the maximum number of abutments, we pick the one with the maximum number of stacks.…”
Section: Variant Of Bipartite Matching W/ Clusteringmentioning
confidence: 99%
“…On the patterning front, disruptive changes include the adoption of one or more of candidate next-generation lithography techniques such as nanoimprint, electron beam direct write, and extreme ultraviolet [1][2][3][4]. Each of these has challenging implications for layout methodologies and design rules (DRs).…”
Section: Introductionmentioning
confidence: 99%
“…As for transistor locations along the vertical direction, we consider three possibilities: a) as near as possible to power rails, b) exactly in the center of p/n networks, and c) as near as possible to p/n interface. The choice of vertical location of transistors is regarded as a layout style, which can also be evaluated by the framework 3 .…”
Section: A Layout Topology Generationmentioning
confidence: 99%
“…On the patterning front, disruptive changes include adoption of one or more of candidate next-generation lithography techniques such as nanoimprint, electron beam direct write, and extreme ultraviolet [1][2][3][4]. Each of these has challenging implications for layout methodologies and design rules (DRs).…”
Section: Introductionmentioning
confidence: 99%
“…In this paper, we focus on the frequency of the ring YCO circuits and, for an around 10 GHz YCO circuit, propose a design method based on a small-signal equivalent circuit analysis, in which the parasitic capacitors and resistances with input node are taken into consideration in more detail than in our previous work [7]. We compare the estimated and measured oscillation characteristics of ring YCO ICs fabricated with the 65-nm MOSFET process [8].…”
Section: Introductionmentioning
confidence: 99%