EBL Bi-layer resist scheme for CdTe/Si submicron structures for lift-off processing

Abellán, Manuel; Anguita, José V.; Sochinskii, N.V.

doi:10.1016/j.mee.2007.01.077

Cited by 3 publications

(3 citation statements)

References 7 publications

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“…As the photoresist is unstable during the high-temperature depositing process, it is hard to obtain thick, adherent and well-defined patterns of the photoresist [11]. Many papers have reported how to strip a thick film, such as single-layer retrograde or undercut profile and double-layer T-shaped overhanging structure [12][13][14]. All of these techniques are expected to create bigger discontinuities at the patterned edges of the dielectric film by shadowing the incident flux of the coating materials, thus facilitating striping and improving the pattern quality obtained by lift-off.…”

Section: Fabrication Of a Microfilter Arraymentioning

confidence: 99%

Patterning of visible/infrared dual-band microstrip filter arrays for multispectral imaging application

Lai

Liang

Zhou

et al. 2009

J. Micromech. Microeng.

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Visible/infrared dual-band microstrip filter arrays have been developed to be integrated with 512 × 512 PtSi CCD imaging sensor chips for multispectral imaging when it operates in the front-illumination mode. A high visible transmittance and high infrared reflectance ZAO (ZnO:Al) based coating for visible passband and an interference absorbing filter film for a mid-infrared passband have been designed and deposited on sapphire substrates. An effective double-layer lift-off technique that is compatible with high temperature deposition has been developed to create thick microstrip infrared film. The infrared passband film using germanium and yttrium fluoride as high and low refractive indices materials have been deposited by ion-beam-assisted electron beam evaporation. Tested optical performance results reveal that the visible and near-infrared transmittance of the infrared passband film is very low, which makes it ideal for mid-infrared imaging. Environmental durability testing shows that the microstrip arrays have good mechanical and thermal performances for practical applications.

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Section: Fabrication Of a Microfilter Arraymentioning

confidence: 99%

Patterning of visible/infrared dual-band microstrip filter arrays for multispectral imaging application

Lai

Liang

Zhou

et al. 2009

J. Micromech. Microeng.

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show abstract

“…Plenty of papers have reported how to strip thick film, such as single layer retrograde or undercut profile and double layer T-shape overhanging structure [14][15][16]. All of these techniques are expected to create bigger discontinuities at the patterned edges of the dielectric film by shadowing the incident flux of the coating materials, thus facilitating striping and enhancing the pattern quality obtained by lift-off.…”

Section: Fabrication Of Microfilter Arraymentioning

confidence: 99%

Design and fabrication of visible/mid-infrared dual-band microfilter array

Liang

Lai

Zhou

et al. 2008

Optoelectronic Materials and Devices III

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Integrated visible/infrared dual-band filter array is the key component of compact, lightweight, rigid miniature dual-band CCD sensing system. Interference cut-off filter array and interference absorbing filter array have been designed for infrared and visible pass band respectively. A simple, effective and compatible with high temperature deposition process lift-off technique for striping thick infrared film was investigated. Integrating photolithography, ion beam assisted electron beam physical vapor deposition and improved lift-off process, dual-band microfilter array with good performance was fabricated on the same sapphire substrate consecutively. Details of design and fabricating procedure are elucidated, and experimental results are presented.

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“…1a shows the ideal undercut profile for a lift-off using single layer positive tone resist. There are two methods to obtain an undercut; count on proximity effect, and use a bilayer resist process [7]. The proximity effect determination is a complex procedure depending on numerous parameters such as exposure dose, electron energy, substrate material, resist thickness, development time, development temperature, etc., to name a few.…”

Section: Introductionmentioning

confidence: 99%

A single layer hydrogen silsesquioxane (HSQ) based lift-off process for germanium and platinum

Passi¹,

Lecestre²,

Krzeminski³

et al. 2010

Microelectronic Engineering

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-Primarily used as etch mask, single layer hydrogen silsesquioxane has never been investigated for lift-off technique. In this article, we propose a new technique where a single layer of hydrogen silsesquioxane, a negative tone electron beam resist, is used to make lift-off of germanium and platinum. Removal of exposed hydrogen silsesquioxane is tested for various concentrations of hydrofluoric acid. Ultrasonic agitation is also used to reduce the formation of flakes due to accumulation of matter (evaporated metal in our case) along the sidewalls of the liftoff narrow slots. Results demonstrate potential in applying the hydrogen silsesquioxane as a negative tone lift-off resist to pattern nanometer scale features into germanium and platinum layers.

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EBL Bi-layer resist scheme for CdTe/Si submicron structures for lift-off processing

Cited by 3 publications

References 7 publications

Patterning of visible/infrared dual-band microstrip filter arrays for multispectral imaging application

Patterning of visible/infrared dual-band microstrip filter arrays for multispectral imaging application

Design and fabrication of visible/mid-infrared dual-band microfilter array

A single layer hydrogen silsesquioxane (HSQ) based lift-off process for germanium and platinum

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