2007
DOI: 10.1149/1.2772093
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Effect of Additives on Electrodeposition of Nanocrystalline Zinc from Acidic Sulfate Solutions

Abstract: The influence of polyethylene glycol ͑PEG͒, cetyltrimethylammonium bromide ͑CTAB͒, benzalacetone ͑BA͒, and thiourea ͑TU͒ on pulse electrodeposition of zinc from acidic sulfate baths was investigated by X-ray diffraction, scanning electron microscopy, and potentiodynamic polarization techniques. The results show that a mixture of PEG and CTAB can fully dissolve BA in the concentrated zinc sulfate solutions. This ternary additive can increase the overpotential of zinc electrodeposition markedly, and then gives r… Show more

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Cited by 64 publications
(44 citation statements)
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“…Among the large number of papers, some are of special interest because they illustrate general trends: pulse plating is studied in order to generate nanocrystalline zinc deposits [260][261][262][263]; organic additives are studied in order to control the morphology and the properties of the deposits, eventually in combination with pulse plating [264][265][266][267][268][269][270][271][272][273][274][275]; texture and surface morphology of zinc and zinc alloys deposited on low carbon steel substrate were further investigated [276][277][278]. [196].…”
Section: Recent Research Advancesmentioning
confidence: 99%
“…Among the large number of papers, some are of special interest because they illustrate general trends: pulse plating is studied in order to generate nanocrystalline zinc deposits [260][261][262][263]; organic additives are studied in order to control the morphology and the properties of the deposits, eventually in combination with pulse plating [264][265][266][267][268][269][270][271][272][273][274][275]; texture and surface morphology of zinc and zinc alloys deposited on low carbon steel substrate were further investigated [276][277][278]. [196].…”
Section: Recent Research Advancesmentioning
confidence: 99%
“…Acid bath was used more often, owing to its high deposition rate and cathodic efficiency. Moreover, this bath does not require complexing agents, leading to less expensive deposition process than alkaline plating bath (Li et al 2007). Organic additives were often added to alloy plating bath, which improves the properties of deposits.…”
Section: Introductionmentioning
confidence: 99%
“…The surfactants like CTAB (cetyltrimethylammonium bromide), SDS (sodium dodecylsulfate), polyethylene glycol (PEG) and Triton X-100 were used as levelers for zinc electroplating [16][17][18][19][20]. Surfactant refines the grain size of deposit, microscopically smoothens the deposit surface, improves throwing power and solubility of brighteners in bath solution [9,21]. Some additives simultaneously act as levelers and brighteners.…”
Section: Introductionmentioning
confidence: 99%