Effect of Ag on Sn–Cu and Sn–Zn lead free solders

Alam, Syed Nasimul; Mishra, Prerna; Kumar, Rajnish

doi:10.1515/msp-2015-0048

Cited by 13 publications

(4 citation statements)

References 26 publications

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“…The eutectic reaction occurred between the intermetallic compound Cu 6 Sn 5 and Sn. The microstructure as predicted from the phase diagram consists of β-Sn and the Cu-Sn intermetallic compound Cu 6 Sn 5 [2].…”

Section: Microstructurementioning

confidence: 99%

Electrical and Thermal Characterisation of Millscale Modified Sn-Cu Lead-Free Solders

Sekunowo

Durowaye

Fashakin

2019

J. Inst. Engineering

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Lead-free solders are gaining much attention as a result of legislation against the inclusion of lead and other hazardous materials in solders used in joining electronic components. This study investigated the effect of iron millscale (IMS) modified tin-copper (Sn-Cu) alloy on the electrical resistivity, electrical, and thermal conductivities of the solder samples under increasing applied current. The input materials consist of tin, zinc and iron millscale while the copper was varied from 0.2 – 1.0 wt. %. Fabrication of the alloy employed metal casting technique followed by relevant test samples preparation for characterisation in terms of microstructure, electrical, and thermal conductivities. Results show that the sample with 1 wt. % Cu addition exhibited the highest electrical and thermal conductivity values of 9967.9 S/m and 11.24 x 10-5 W/mK respectively at applied current value of 600 A with the lowest resistivity of 1 x 10-4 (Ωm). The solder alloy microstructure confirmed the presence of Cu6Sn5-FeO intermetallic phase dispersed in Sn matrix forming a continuous network. Contribution to the overall desirable performance of the solder alloy may have stemmed from the strong and coherent inter-crystal cohesion between the Cu6Sn3 and FeO phases which resulted in improved electrical and thermal conductivities of the as cast solder. The grade of solder alloy fabricated is adjudged suitable for assembling electronic components in industrial plant control panels.

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Section: Microstructurementioning

confidence: 99%

Electrical and Thermal Characterisation of Millscale Modified Sn-Cu Lead-Free Solders

Sekunowo

Durowaye

Fashakin

2019

J. Inst. Engineering

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“…% Ag to Sn-0.7Cu eutectic alloy on the microstructure, mechanical properties (hardness) and thermal properties. They found reduction in melting temperature from 234.88•C to 226.89 •C and increasing in the hardness, while by adding Ag up to 2.5 wt.% the hardness was decreased [13]. Also, the addition of Ni, Co, Ga, In, Bi or rare earth elements into Sn-0.7Cu solder showed improvement of hardness [14].…”

Section: Introductionmentioning

confidence: 97%

Effects of Zn and Sb additions on micro-structure, creep behavior and thermal properties of binary eutectic Sn-0.7%Cu lead-free solder

Yassin

2019

Arab Journal of Nuclear Sciences and Applications

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The effects of Zn and Sb additions on microstructure, creep behavior and thermal properties of binary eutectic Sn-0.7% Cu lead-free solder were investigated. Results show that Zn-addition reduced the melting temperature of Sn-0.7Cu and enhanced the creep resistance due to the formation of Cu 5 Zn 8 intermetallic compound (IMC) and reduction of Cu 6 Sn 5 phase in β-Sn matrix. Conversely, the Sbaddition showed a negative effect on both the creep resistance and melting temperature compared to the plain Sn-0.7 Cu and Sn-0.7 Cu-2.0 Zn alloys due to the formation of SnSb IMC particles and coarse Cu 6 Sn 5 phase through the β-Sn rich phase. The average stress exponents of 4.9-6.0 and activation energies of 50-60 KJ/mol were obtained for three solders; suggesting that the dislocation climb controlled by lattice diffusion is the dominant creep mechanism. X-ray diffraction (XRD) analysis revealed that the lattice parameters (a), (c), the axial rate (c/a) and the peak height intensities (hkl) of some crystallographic planes are changed with alloying additions and the crystallite size is decreased.

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“…Moreover, this solder has a three to four times longer fatigue life compared with the eutectic Sn-Pb solder alloy. 4 The addition of a tiny amount of silver improves wettability and ductility, 5 lowers the melting point, 6 and improves oxidation resistance. 7 The ceramic nanofillers possess good thermal stability, hydrophilicity, low cost, and non-toxicity.…”

Section: Introductionmentioning

confidence: 99%

Enhancing the tensile properties of Sn-Zn-Ag lead-free solder alloy by loading MgO nanoparticles and irradiation

Mohammed

Alruwaili

El‐Gamal

2022

Journal of Composite Materials

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Lead-free composite solders has attracted more attention as they are required in the microelectronics industry to assure good electrical connections and the best mechanical response between integrated circuit devices and the substrate. The mechanical mixing technique was used to prepare the plain (Sn-5.3 wt% Zn-1 wt% Ag, SZA531) and composite solder (SZA531/0.5 wt% MgO), while MgO nanoparticles were synthesized by sol-gel technique. The aim to investigate the effects of loading 0.5 wt% MgO NPs and [Formula: see text]-irradiation doses (0–2.0 MGy) on the tensile properties of plain solder at different strain rates (ε•). The microstructural properties revealed that MgO was pure, crystalline, and had a nanoparticle-like morphology with an average crystallite size of 9.61 nm. Plain and composite solders contained β-Sn, Zn, and Ag, as well as some intermetallic compounds, Ag3Sn and AgZn. Loading MgO refined [Formula: see text]-Sn and Ag3Sn, while AgZn particles were partially dissolved. The thermal analysis reported that the melting point slightly increased from 206.1°C with SZA531 to 208.7°C when loaded which confirms the good solderability of composite solder. The tensile properties revealed that ultimate tensile strength and the tensile toughness increased with increasing ε•, dose of γ-rays, and MgO loading, while ductility decreased. The strain rate sensitivity index ( m) decrease with increasing the dose and MgO loading because of the decrease in the resistance to necking. These results were interpreted based on Orowan strengthening and dislocation strengthening.

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Effect of Ag on Sn–Cu and Sn–Zn lead free solders

Cited by 13 publications

References 26 publications

Electrical and Thermal Characterisation of Millscale Modified Sn-Cu Lead-Free Solders

Electrical and Thermal Characterisation of Millscale Modified Sn-Cu Lead-Free Solders

Effects of Zn and Sb additions on micro-structure, creep behavior and thermal properties of binary eutectic Sn-0.7%Cu lead-free solder

Enhancing the tensile properties of Sn-Zn-Ag lead-free solder alloy by loading MgO nanoparticles and irradiation

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