2017
DOI: 10.1063/1.4968297
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Effect of anneal temperature on fluorine doped tin oxide (FTO) nanostructured fabricated using hydrothermal method

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Cited by 4 publications
(4 citation statements)
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“…Moreover, we characterize the crystallinity of the three TCOs using X-ray diffraction (XRD) characterization (Figure S4a). In line with the literature, ITO and IO:H TCOs are crystalline with preferential orientation along their (222) planes, whereas FTO is crystalline with a dominant orientation along its (110) plane . The high crystallinity of IO:H observed from the XRD measurements is indicative of larger crystallites compared to the commercial ITO.…”
Section: Results and Discussionsupporting
confidence: 86%
See 1 more Smart Citation
“…Moreover, we characterize the crystallinity of the three TCOs using X-ray diffraction (XRD) characterization (Figure S4a). In line with the literature, ITO and IO:H TCOs are crystalline with preferential orientation along their (222) planes, whereas FTO is crystalline with a dominant orientation along its (110) plane . The high crystallinity of IO:H observed from the XRD measurements is indicative of larger crystallites compared to the commercial ITO.…”
Section: Results and Discussionsupporting
confidence: 86%
“…In line with the literature, ITO and IO:H TCOs are crystalline with preferential orientation along their (222) planes, 40 whereas FTO is crystalline with a dominant orientation along its (110) plane. 45 The high crystallinity of IO:H observed from the XRD measurements is indicative of larger crystallites compared to the commercial ITO. An analysis on the XRD reflection peaks of the TCOs (see the Supporting Information for details) confirms that, compared to the commercial ITO, the in-house sputtered IO:H layer possesses considerably sharper reflection peaks with reduced full width at half-maximum (FWHM) and larger crystallites (Table S2).…”
Section: ■ Results and Discussionmentioning
confidence: 96%
“…Figure 3b,c reveals the analyzed spatial displacement (deformation), strain and stress across the Cu:NiO x /FTO/glass multilayer when annealed at 400 • C. Figure 3b shows that the Cu:NiO x layer formed would not extensively deform the multilayer. The FTO layer experiences the highest strains and stresses from the heating while the glass substrate is observed to withstand most of the thermal stresses and strains achieved in Figure 3c,d [45]. This method of fabricating the Cu:NiO x HTL can also be translated onto a polymeric or flexible substrate on the condition that their thermal capacity can accommodate the high temperatures utilized here.…”
Section: Finite Element Analysis Using Abaqus/caementioning
confidence: 84%
“…In metal-semiconductor and metal-insulator-semiconductor structures, the metallic opaque layer can be substituted with an FTO layer [21]. FTO films can be deposited using various techniques, including sputtering, sol-gel process, spray pyrolysis, chemical vapor deposition (CVD), pulsed laser deposition (PLD), dip coating, inkjet printing, magnetron sputtering, and hydrothermal method [22][23][24][25][26][27]. Among these techniques, spray pyrolysis offers several advantages, making it an easily adoptable and cost-effective option for industry applications [3,7,9].…”
Section: Introductionmentioning
confidence: 99%