2019
DOI: 10.1002/mats.201900045
|View full text |Cite
|
Sign up to set email alerts
|

Effect of Bonded Interfacial Structure on Mechanical Properties of Polyimide/SiO2Composites: Molecular Dynamics Simulations

Abstract: The effect of covalent bonds and the SiO2 concentration on the interface structure and the performance of polyimide/SiO2 (PI/SiO2) composites is investigated by molecular dynamic simulation. To enhance the interface interaction, the silica coupling agent is treated as a bridge to connect PI chains with SiO2 particles. The SiO2 content is controlled by adjusting the number of PI chains. The results show that the bonded interface structure not only increases the interfacial non‐bond energy and the number of the … Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1

Citation Types

1
5
0

Year Published

2020
2020
2023
2023

Publication Types

Select...
6

Relationship

2
4

Authors

Journals

citations
Cited by 15 publications
(6 citation statements)
references
References 33 publications
1
5
0
Order By: Relevance
“…In contrast, the barriers for Na diffusing in the interface regions are higher because of the repulsion between Na and PANI. Nonetheless, these values are still comparable to those obtained on other hybrid 2D systems [46,47], suggesting that the formed M/P composites could afford fast charging/discharging rates as SIB electrodes. This conjecture can also be supported by the estimated diffusion coefficient according to D = A 2 v * exp (−∆E/K B T), where a, v, ∆E, K B and T are the distance between the two nearest neighboring sites, the hopping frequency (∼10 13 Hz), the diffusion barrier, the Boltzmann constant, and temperature (300 K), respectively.…”
Section: Resultssupporting
confidence: 79%
“…In contrast, the barriers for Na diffusing in the interface regions are higher because of the repulsion between Na and PANI. Nonetheless, these values are still comparable to those obtained on other hybrid 2D systems [46,47], suggesting that the formed M/P composites could afford fast charging/discharging rates as SIB electrodes. This conjecture can also be supported by the estimated diffusion coefficient according to D = A 2 v * exp (−∆E/K B T), where a, v, ∆E, K B and T are the distance between the two nearest neighboring sites, the hopping frequency (∼10 13 Hz), the diffusion barrier, the Boltzmann constant, and temperature (300 K), respectively.…”
Section: Resultssupporting
confidence: 79%
“…Considering that the hydrogens at the SOD surface and N/O atoms in the PI form hydrogen bonds, these results indicate that the adhesion force contributed by the hydrogen bond is similar before and after the plasma process. [34] The applicability of our laser detachment method was demonstrated for flexible a-IGZO TFTs on PI substrates. [25] The inner region of each carrier surface was controlled to have different adhesion values (<1.50, 3.33, and 12.1 kgf m -1 ).…”
Section: Resultsmentioning
confidence: 96%
“…The number of hydrogen bonds could be calculated by the radial distribution function, which could describe the distribution probability of the particles. [20] The number of hydrogen bonds of N…H and O….H were calculated by integrating g(N…H) and g(O…H).…”
Section: Hydrogen Bondsmentioning
confidence: 99%
“…The non-bond interaction energy between polymer and particles could be obtained as Equation 3. [20] E…”
Section: Non-bond Interaction Energymentioning
confidence: 99%