2017
DOI: 10.1016/j.mejo.2017.03.015
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Effect of cooling fluids on high frequency electric and magnetic fields in microelectronic systems with integrated TSVs

Abstract: A B S T R A C TA fully 3D conjugate numerical analysis was performed to reveal the effects of air, R134a refrigerant and water on electromagnetic fields of electronic cooling designs made of arrays of micro pin-fins with integrated Through-Silicon-Vias (TSVs). The integrated TSV cooling configuration included 8 cylindrical TSVs with 150 µm diameter each and 200 µm height. The external dimensions of the silicon substrate were 900×700×280 µm. Each TSV encapsulated four equally spaced copper vias each having a di… Show more

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