2021
DOI: 10.1109/led.2021.3049329
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Effect of Crystallinity on the Electrical Characteristics of Poly-Si Tunneling FETs via Green Nanosecond Laser Crystallization

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Cited by 4 publications
(5 citation statements)
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“…Ion and Ioff at VGS = 0 V increase with increasing temperature, and the increase in Ioff is larger than that in Ion. Accordingly, Ion/Ioff increases from 5.01 × 10 9 to 1.35 × 10 10 as the temperature increases from 250 to 325 K, and subsequently, it decreases to 3.92 × 10 8 at 400 K. Nevertheless, our device exhibits outstanding Ion/Ioff (>10 8 ) over a wide temperature range compared to other steep switching devices [11]- [14]. Figure 4(b) shows the simulated IDS-VGS transfer curves, which present similar trends to the experimental data.…”
Section: Resultsmentioning
confidence: 85%
“…Ion and Ioff at VGS = 0 V increase with increasing temperature, and the increase in Ioff is larger than that in Ion. Accordingly, Ion/Ioff increases from 5.01 × 10 9 to 1.35 × 10 10 as the temperature increases from 250 to 325 K, and subsequently, it decreases to 3.92 × 10 8 at 400 K. Nevertheless, our device exhibits outstanding Ion/Ioff (>10 8 ) over a wide temperature range compared to other steep switching devices [11]- [14]. Figure 4(b) shows the simulated IDS-VGS transfer curves, which present similar trends to the experimental data.…”
Section: Resultsmentioning
confidence: 85%
“…Currently, there are three main approaches to producing highquality top-layered thin films: layer transfer technology, [5][6][7][8] selective epitaxial growth, [9][10][11][12][13] and film crystallization technology. [14][15][16][17][18][19] However, it is crucial to acknowledge that the involved complex procedure lacks cost-effectiveness due to its intricate nature and high processing costs. Selective epitaxial growth, which involves high thermal demands, has the potential to degrade the quality of existing bottom devices and increase fabrication costs due to the need for extended annealing.…”
Section: Introductionmentioning
confidence: 99%
“…7 Fortunately, the impact of grainboundary traps can be mitigated by enlarging the grain size. In the past decades, several low-temperature crystallization methods, including solid-phase crystallization (SPC), [8][9][10] metal-induced crystallization (MIC) 11,12 and laser crystallization, 5,[13][14][15][16] have been proposed and performed on amorphous silicon (a-Si) layers via phase transition to a polycrystalline-state. SPC is usually executed by annealing the a-Si layer in a nitrogen ambient at a sufficiently low temperature (e.g., 600 o C) for a time-duration longer than 12 h. 8,9 The SPC process is a simple and mature technology without resorting to complex fabrication tools, but it takes a long duration of time for phase transition.…”
mentioning
confidence: 99%
“…5 Recently, green-nanoseconds laser crystallization (GLC) has been proposed as an alternative approach for boosting dc performance of poly-Si TFTs. [14][15][16] In comparison to ELC, GLC approach offers the advantages of faster running time, lower maintenance cost, and larger process window. 14,15 GLC has been applied for the construction of monolithically-integrated, threedimensional electronics.…”
mentioning
confidence: 99%
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