2016
DOI: 10.1016/j.apsusc.2015.12.089
|View full text |Cite
|
Sign up to set email alerts
|

Effect of different parameters on machining of SiC/SiC composites via pico-second laser

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
4
1

Citation Types

0
14
0

Year Published

2017
2017
2024
2024

Publication Types

Select...
5
1
1

Relationship

0
7

Authors

Journals

citations
Cited by 90 publications
(14 citation statements)
references
References 20 publications
0
14
0
Order By: Relevance
“…To reaffirm the formation of an oxide layer when machining SiC-based CMCs and obtain further information, a quantitative analysis was performed by measuring the atomic percentage of elements via X-Ray Photoelectron Spectroscopy (XPS). As shown in Figure 21, the results clearly demonstrated an increase of the oxygen content in the machined surface when rising the laser power [62]. showing a the XPS quantitative analysis for different processing powers [62].…”
Section: Non-conventional Machining 41 Pulsed Laser Ablation (Pla)mentioning
confidence: 81%
See 3 more Smart Citations
“…To reaffirm the formation of an oxide layer when machining SiC-based CMCs and obtain further information, a quantitative analysis was performed by measuring the atomic percentage of elements via X-Ray Photoelectron Spectroscopy (XPS). As shown in Figure 21, the results clearly demonstrated an increase of the oxygen content in the machined surface when rising the laser power [62]. showing a the XPS quantitative analysis for different processing powers [62].…”
Section: Non-conventional Machining 41 Pulsed Laser Ablation (Pla)mentioning
confidence: 81%
“…As shown in Figure 21, the results clearly demonstrated an increase of the oxygen content in the machined surface when rising the laser power [62]. showing a the XPS quantitative analysis for different processing powers [62].…”
Section: Non-conventional Machining 41 Pulsed Laser Ablation (Pla)mentioning
confidence: 81%
See 2 more Smart Citations
“…However, due to the existence of hard ceramic matrix, CMCs are regarded as typical difficult-to-machine materials. In order to improve the machining of CMCs, various conventional and unconventional processing methods have been introduced, such as grinding [2], laser beam machining [3], rotary ultrasonic machining [4]. Rotary ultrasonic machining has been sufficiently proved to be suitable for the hole manufacturing of CMCs, with dramatically reduced cutting force and improved hole exit quality [4].…”
Section: Introductionmentioning
confidence: 99%