2005
DOI: 10.1109/tns.2005.860681
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Effect of different total ionizing dose sources on charge loss from programmed floating gate cells

Abstract: We irradiated programmed Floating Gate (FG) memory arrays with different radiation sources, including 10 keV X-rays, 60 Co -rays, and 27 MeV protons. After irradiation, FGs experience a net charge loss which can degrade the stored information in terms of MOSFET threshold voltage. The charge loss is the result of two different phenomena: charge generation/recombination in the oxides and photoemission from the FG. The threshold voltage shift in irradiated devices depends on the radiation source: strong dose enha… Show more

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Cited by 41 publications
(11 citation statements)
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“…These effects do not strongly depend on scaling [51], partially because there is no more scaling of the oxide thicknesses from one generation to the next due to reliability issues. Differences between various sources of TID and dose enhancement effects have been addressed in [57]. Thanks to their sensitivity, FG devices have been proposed as radiation dosimeters [58]- [62].…”
Section: Radiation Effectsmentioning
confidence: 99%
“…These effects do not strongly depend on scaling [51], partially because there is no more scaling of the oxide thicknesses from one generation to the next due to reliability issues. Differences between various sources of TID and dose enhancement effects have been addressed in [57]. Thanks to their sensitivity, FG devices have been proposed as radiation dosimeters [58]- [62].…”
Section: Radiation Effectsmentioning
confidence: 99%
“…This is illustrated in Fig. A physics model to account for these effects has been first developed by Snyder et al in 1989 [48] and further developed in recent times to account for the changes in the technology happened in almost 20 years [51,52]. Before irradiation, V TH distributions closely resemble the expected Gaussian shape.…”
Section: Total Ionizing Dosementioning
confidence: 97%
“…This issue was first addressed in NOR architecture [51] but it is more severe in NAND architecture [52] because of the smaller cell size (4F²) and therefore smaller distance to adjacent cells. 3.1.3 the threshold voltage of the floating gate cell is not a device constant but it is also dependent on its environment.…”
Section: Floating Gate Cross-couplingmentioning
confidence: 99%
“…Part of them will be injected Fig 4), while the remaining will be trapped in the oxide (second contribution , Fig 4), the electrons stored in the FG are photo-emitted (third contribution, Fig 4), gaining enough energy from the impinging radiation to jump over the energy barrier of the oxide [9] [11] [12]. [13]. In these works specified that …”
Section: Tid Eff Ect On Fg Memory Cellsmentioning
confidence: 99%