2013
DOI: 10.1016/j.surfcoat.2013.10.020
|View full text |Cite
|
Sign up to set email alerts
|

Effect of electrodeposition parameters on chemical and morphological characteristics of Cu–Sn coatings from a methanesulfonic acid electrolyte

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

2
21
0
1

Year Published

2015
2015
2024
2024

Publication Types

Select...
10

Relationship

0
10

Authors

Journals

citations
Cited by 37 publications
(24 citation statements)
references
References 46 publications
2
21
0
1
Order By: Relevance
“…The morphology of Cu-Sn alloys in the form of spherical grains is well reported in literature 1,27,28 .Other surface morphologies are also reported for Cu-Sn alloys, such as needles 29 and the dendritic morphology 30 . This latter morphology is usually associated with a coating in which the copper ions reduction was favored, decreasing the reduction of tin ions.…”
Section: Morphological Evaluation By Scanning Electron Microscopy (Sem)mentioning
confidence: 55%
“…The morphology of Cu-Sn alloys in the form of spherical grains is well reported in literature 1,27,28 .Other surface morphologies are also reported for Cu-Sn alloys, such as needles 29 and the dendritic morphology 30 . This latter morphology is usually associated with a coating in which the copper ions reduction was favored, decreasing the reduction of tin ions.…”
Section: Morphological Evaluation By Scanning Electron Microscopy (Sem)mentioning
confidence: 55%
“…Figure 2b presents the surface topography of CuSn-Cr coated piston ring. The surface topography is also shown to be distributed with mesh texture, and different sized Cu-Sn alloys are scattered on the surface in the form of spherical grains [36][37][38]. Figure 3 shows the piston ring reciprocating liner test rig [39].…”
Section: Figure 2amentioning
confidence: 99%
“…Because the mechanical and electrical reliability of the Sn based alloy solders are highly dependent on the electroplating conditions, [15][16][17][18][19][20][21] the degradation of the electroplating bath leads to packaging problems. 1,3,22,23 Indeed, issues such as the collapse of solder bumps during solder reow and the non-wetting phenomena of solder surfaces with the base metal can be observed more frequently as the electroplating bath solution approaches the end of its lifetime. 2,24 The collapse of the solder bumps leads to a non-contact failure, or a critical bridging failure between neighboring bumps, which results in enormous product loss and an increase in production costs.…”
Section: 9mentioning
confidence: 99%